
AMD Xilinx
XCV600E-8FGG676C
XCV600E-8FGG676C ECAD Model
XCV600E-8FGG676C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.8 V | |
Number of Inputs | 444 | |
Number of Outputs | 444 | |
Number of Logic Cells | 15552 | |
Number of Equivalent Gates | 186624 | |
Number of CLBs | 3456 | |
Combinatorial Delay of a CLB-Max | 400 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 3456 CLBS, 186624 GATES | |
Clock Frequency-Max | 416 MHz | |
Power Supplies | 1.2/3.6,1.8 V | |
Supply Voltage-Max | 1.89 V | |
Supply Voltage-Min | 1.71 V | |
JESD-30 Code | S-PBGA-B676 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 250 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 676 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA676,26X26,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 27 mm | |
Length | 27 mm | |
Seated Height-Max | 2.6 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | FBGA-676 | |
Pin Count | 676 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 | |
ECCN Code | EAR99 |
XCV600E-8FGG676C Datasheet Download
XCV600E-8FGG676C Overview
The chip model XCV600E-8FGG676C is an advanced piece of technology that has the potential to revolutionize the way networks are used and managed in the future. This chip is designed to be used in intelligent systems, allowing for more efficient and reliable communication between devices. It is capable of providing an array of services, such as data transmission, storage, and processing, as well as providing an optimized platform for the development of intelligent robots.
The XCV600E-8FGG676C chip model is a powerful tool that can be used to create a wide range of networked systems. It is capable of supporting a variety of protocols, including Ethernet, Wi-Fi, and Bluetooth, and can be used to create a robust, secure, and reliable network. This chip is also designed to be used in intelligent systems, allowing for more efficient and reliable communication between devices.
The product description and specific design requirements of the XCV600E-8FGG676C chip model are quite detailed and complex. It is important to understand the details of the product before attempting to use it in any real-world applications. The chip model has a variety of features, such as a high-speed processor, an advanced memory system, and an efficient power management system. It also has several safety features, such as a secure boot-up process and a secure data storage system.
In addition to the product description, there are several case studies and precautions that must be taken into consideration when using the XCV600E-8FGG676C chip model. It is important to understand the potential risks associated with using this chip model, as well as the potential benefits that can be gained by using it in intelligent systems. It is also important to understand the technical requirements and skills that are needed to use the chip model effectively.
The XCV600E-8FGG676C chip model has the potential to be used in the development and popularization of future intelligent robots. It is capable of providing the necessary hardware and software components to create an efficient and reliable network for intelligent robots. This chip model can also be used to create a secure and reliable platform for the development of intelligent robots. In order to use the chip model effectively, it is important to have a good understanding of the technical skills and requirements that are needed.
Overall, the XCV600E-8FGG676C chip model is an advanced piece of technology that has the potential to revolutionize the way networks are used and managed in the future. It is capable of providing an array of services, such as data transmission, storage, and processing, as well as providing an optimized platform for the development of intelligent robots. It is important to understand the product description and specific design requirements of the chip model, as well as the potential risks and benefits associated with its use. With the right technical skills and understanding, the XCV600E-8FGG676C chip model can be used to create a secure and reliable network for intelligent robots and other intelligent systems.
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3,464 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $238.0800 | $238.0800 |
10+ | $235.5200 | $2,355.2000 |
100+ | $222.7200 | $22,272.0000 |
1000+ | $209.9200 | $104,960.0000 |
10000+ | $192.0000 | $192,000.0000 |
The price is for reference only, please refer to the actual quotation! |