XCV600E-8FGG676C
XCV600E-8FGG676C
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rohs

AMD Xilinx

XCV600E-8FGG676C


XCV600E-8FGG676C
F20-XCV600E-8FGG676C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, FBGA-676
FBGA-676

XCV600E-8FGG676C ECAD Model


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XCV600E-8FGG676C Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.8 V
Number of Inputs 444
Number of Outputs 444
Number of Logic Cells 15552
Number of Equivalent Gates 186624
Number of CLBs 3456
Combinatorial Delay of a CLB-Max 400 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 3456 CLBS, 186624 GATES
Clock Frequency-Max 416 MHz
Power Supplies 1.2/3.6,1.8 V
Supply Voltage-Max 1.89 V
Supply Voltage-Min 1.71 V
JESD-30 Code S-PBGA-B676
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 676
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA676,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 2.6 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description FBGA-676
Pin Count 676
Reach Compliance Code unknown
HTS Code 8542.39.00.01
ECCN Code EAR99

XCV600E-8FGG676C Datasheet Download


XCV600E-8FGG676C Overview



The chip model XCV600E-8FGG676C is an advanced piece of technology that has the potential to revolutionize the way networks are used and managed in the future. This chip is designed to be used in intelligent systems, allowing for more efficient and reliable communication between devices. It is capable of providing an array of services, such as data transmission, storage, and processing, as well as providing an optimized platform for the development of intelligent robots.


The XCV600E-8FGG676C chip model is a powerful tool that can be used to create a wide range of networked systems. It is capable of supporting a variety of protocols, including Ethernet, Wi-Fi, and Bluetooth, and can be used to create a robust, secure, and reliable network. This chip is also designed to be used in intelligent systems, allowing for more efficient and reliable communication between devices.


The product description and specific design requirements of the XCV600E-8FGG676C chip model are quite detailed and complex. It is important to understand the details of the product before attempting to use it in any real-world applications. The chip model has a variety of features, such as a high-speed processor, an advanced memory system, and an efficient power management system. It also has several safety features, such as a secure boot-up process and a secure data storage system.


In addition to the product description, there are several case studies and precautions that must be taken into consideration when using the XCV600E-8FGG676C chip model. It is important to understand the potential risks associated with using this chip model, as well as the potential benefits that can be gained by using it in intelligent systems. It is also important to understand the technical requirements and skills that are needed to use the chip model effectively.


The XCV600E-8FGG676C chip model has the potential to be used in the development and popularization of future intelligent robots. It is capable of providing the necessary hardware and software components to create an efficient and reliable network for intelligent robots. This chip model can also be used to create a secure and reliable platform for the development of intelligent robots. In order to use the chip model effectively, it is important to have a good understanding of the technical skills and requirements that are needed.


Overall, the XCV600E-8FGG676C chip model is an advanced piece of technology that has the potential to revolutionize the way networks are used and managed in the future. It is capable of providing an array of services, such as data transmission, storage, and processing, as well as providing an optimized platform for the development of intelligent robots. It is important to understand the product description and specific design requirements of the chip model, as well as the potential risks and benefits associated with its use. With the right technical skills and understanding, the XCV600E-8FGG676C chip model can be used to create a secure and reliable network for intelligent robots and other intelligent systems.



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QTY Unit Price Ext Price
1+ $238.0800 $238.0800
10+ $235.5200 $2,355.2000
100+ $222.7200 $22,272.0000
1000+ $209.9200 $104,960.0000
10000+ $192.0000 $192,000.0000
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