AMD Xilinx
XCV600E-8BGG560I
XCV600E-8BGG560I ECAD Model
XCV600E-8BGG560I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 404 | |
| Number of Outputs | 404 | |
| Number of Logic Cells | 15552 | |
| Number of Equivalent Gates | 186624 | |
| Number of CLBs | 3456 | |
| Combinatorial Delay of a CLB-Max | 400 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 3456 CLBS, 186624 GATES | |
| Clock Frequency-Max | 416 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA560,33X33,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LBGA, BGA560,33X33,50 | |
| Pin Count | 560 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV600E-8BGG560I Datasheet Download
XCV600E-8BGG560I Overview
The chip model XCV600E-8BGG560I is a powerful and reliable semiconductor device that has been gaining traction in the industry due to its advanced features and capabilities. It is an 8-bit, 560 MHz processor designed to handle a wide range of applications, from embedded systems to industrial automation. The device is particularly well-suited for use in applications that require high performance, low power consumption, and cost-effectiveness.
The XCV600E-8BGG560I is capable of supporting a variety of technologies, including Bluetooth, Wi-Fi, and Zigbee, as well as a range of communication protocols such as CAN, I2C, and SPI. It is also capable of handling multiple operating systems, including Linux, Windows, and Android. This makes it an ideal choice for a wide variety of applications, from industrial automation to consumer electronics.
In addition to its advanced features, the XCV600E-8BGG560I is also highly reliable. It has a long life cycle and is capable of operating in extreme temperatures, from -40°C to +85°C. This makes it suitable for use in harsh environments, such as those encountered in the automotive, aerospace, and medical industries.
The XCV600E-8BGG560I is expected to gain even more traction in the industry due to its low cost and high performance. As more applications are developed for the chip, the demand for the device is expected to grow. This could lead to a surge in demand for the XCV600E-8BGG560I in the future.
The XCV600E-8BGG560I is also well-suited for use in networks and intelligent scenarios. It is capable of supporting a range of communication protocols and is capable of handling multiple operating systems. This makes it an ideal choice for use in intelligent systems, such as those used in autonomous vehicles and smart homes. The chip is also capable of supporting the latest technologies, such as artificial intelligence and machine learning. This makes it an ideal choice for use in the era of fully intelligent systems.
Overall, the XCV600E-8BGG560I is a powerful and reliable chip model that is well-suited for a variety of applications. It has a long life cycle, is capable of supporting a range of technologies, and is capable of handling multiple operating systems. It is also capable of supporting the latest technologies, such as artificial intelligence and machine learning. As a result, the XCV600E-8BGG560I is expected to gain even more traction in the industry in the future, as more applications are developed for the chip and the demand for the device increases.
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