XCV600E-7FGG676I
XCV600E-7FGG676I
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rohs

AMD Xilinx

XCV600E-7FGG676I


XCV600E-7FGG676I
F20-XCV600E-7FGG676I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, FBGA-676
FBGA-676

XCV600E-7FGG676I ECAD Model


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XCV600E-7FGG676I Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.8 V
Number of Inputs 444
Number of Outputs 444
Number of Logic Cells 15552
Number of Equivalent Gates 186624
Number of CLBs 3456
Combinatorial Delay of a CLB-Max 420 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Organization 3456 CLBS, 186624 GATES
Clock Frequency-Max 400 MHz
Power Supplies 1.2/3.6,1.8 V
Supply Voltage-Max 1.89 V
Supply Voltage-Min 1.71 V
JESD-30 Code S-PBGA-B676
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 676
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA676,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 2.6 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description FBGA-676
Pin Count 676
Reach Compliance Code unknown
HTS Code 8542.39.00.01
ECCN Code EAR99

XCV600E-7FGG676I Datasheet Download


XCV600E-7FGG676I Overview



The XCV600E-7FGG676I chip model is a ground-breaking piece of technology that has the potential to revolutionize the way we use technology in the future. Developed by Xilinx, this chip model has been designed to provide high-performance, low-power solutions for a variety of applications, from industrial automation to communications systems.


The main advantages of the XCV600E-7FGG676I chip model are its low power consumption, high-speed processing, and scalability. Its low power consumption makes it an ideal choice for applications that require minimal power consumption, while its high-speed processing capabilities make it suitable for applications that require fast response times. The chip model is also highly scalable, allowing users to easily add more features and functionality as needed.


The XCV600E-7FGG676I chip model is expected to be in high demand in the future, as its capabilities will be essential for the development of advanced communication systems. With its low power consumption and high-speed processing, the chip model is ideal for applications such as 5G networks, IoT applications, and autonomous vehicle systems. In addition, its scalability makes it suitable for future upgrades, meaning that it can be used for a variety of applications as technology advances.


The XCV600E-7FGG676I chip model can also be applied to networks and intelligent scenarios in the future. For example, it can be used for the development of intelligent networks that can process large amounts of data quickly and accurately. It can also be used in the development of autonomous systems, such as self-driving cars or drones, as its scalability allows it to be upgraded as technology advances. Additionally, the chip model can be used in the era of fully intelligent systems, as it has the capability to process large amounts of data quickly and accurately.


Overall, the XCV600E-7FGG676I chip model is a revolutionary piece of technology that has the potential to revolutionize the way we use technology in the future. With its low power consumption, high-speed processing, and scalability, the chip model is ideal for applications such as 5G networks, IoT applications, and autonomous vehicle systems. In addition, its scalability makes it suitable for future upgrades, meaning that it can be used for a variety of applications as technology advances. Finally, the chip model can be used in the era of fully intelligent systems, as it has the capability to process large amounts of data quickly and accurately. As such, the XCV600E-7FGG676I chip model is expected to be in high demand in the future, and is sure to revolutionize the way we use technology.



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