
AMD Xilinx
XCV600E-7FGG676I
XCV600E-7FGG676I ECAD Model
XCV600E-7FGG676I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.8 V | |
Number of Inputs | 444 | |
Number of Outputs | 444 | |
Number of Logic Cells | 15552 | |
Number of Equivalent Gates | 186624 | |
Number of CLBs | 3456 | |
Combinatorial Delay of a CLB-Max | 420 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 3456 CLBS, 186624 GATES | |
Clock Frequency-Max | 400 MHz | |
Power Supplies | 1.2/3.6,1.8 V | |
Supply Voltage-Max | 1.89 V | |
Supply Voltage-Min | 1.71 V | |
JESD-30 Code | S-PBGA-B676 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Peak Reflow Temperature (Cel) | 250 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 676 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA676,26X26,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 27 mm | |
Length | 27 mm | |
Seated Height-Max | 2.6 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | FBGA-676 | |
Pin Count | 676 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 | |
ECCN Code | EAR99 |
XCV600E-7FGG676I Datasheet Download
XCV600E-7FGG676I Overview
The XCV600E-7FGG676I chip model is a ground-breaking piece of technology that has the potential to revolutionize the way we use technology in the future. Developed by Xilinx, this chip model has been designed to provide high-performance, low-power solutions for a variety of applications, from industrial automation to communications systems.
The main advantages of the XCV600E-7FGG676I chip model are its low power consumption, high-speed processing, and scalability. Its low power consumption makes it an ideal choice for applications that require minimal power consumption, while its high-speed processing capabilities make it suitable for applications that require fast response times. The chip model is also highly scalable, allowing users to easily add more features and functionality as needed.
The XCV600E-7FGG676I chip model is expected to be in high demand in the future, as its capabilities will be essential for the development of advanced communication systems. With its low power consumption and high-speed processing, the chip model is ideal for applications such as 5G networks, IoT applications, and autonomous vehicle systems. In addition, its scalability makes it suitable for future upgrades, meaning that it can be used for a variety of applications as technology advances.
The XCV600E-7FGG676I chip model can also be applied to networks and intelligent scenarios in the future. For example, it can be used for the development of intelligent networks that can process large amounts of data quickly and accurately. It can also be used in the development of autonomous systems, such as self-driving cars or drones, as its scalability allows it to be upgraded as technology advances. Additionally, the chip model can be used in the era of fully intelligent systems, as it has the capability to process large amounts of data quickly and accurately.
Overall, the XCV600E-7FGG676I chip model is a revolutionary piece of technology that has the potential to revolutionize the way we use technology in the future. With its low power consumption, high-speed processing, and scalability, the chip model is ideal for applications such as 5G networks, IoT applications, and autonomous vehicle systems. In addition, its scalability makes it suitable for future upgrades, meaning that it can be used for a variety of applications as technology advances. Finally, the chip model can be used in the era of fully intelligent systems, as it has the capability to process large amounts of data quickly and accurately. As such, the XCV600E-7FGG676I chip model is expected to be in high demand in the future, and is sure to revolutionize the way we use technology.
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