XCV600E-7FGG676C
XCV600E-7FGG676C
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rohs

AMD Xilinx

XCV600E-7FGG676C


XCV600E-7FGG676C
F20-XCV600E-7FGG676C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, FBGA-676
FBGA-676

XCV600E-7FGG676C ECAD Model


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XCV600E-7FGG676C Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.8 V
Number of Inputs 444
Number of Outputs 444
Number of Logic Cells 15552
Number of Equivalent Gates 186624
Number of CLBs 3456
Combinatorial Delay of a CLB-Max 420 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 3456 CLBS, 186624 GATES
Clock Frequency-Max 400 MHz
Power Supplies 1.2/3.6,1.8 V
Supply Voltage-Max 1.89 V
Supply Voltage-Min 1.71 V
JESD-30 Code S-PBGA-B676
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 676
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA676,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 2.6 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description FBGA-676
Pin Count 676
Reach Compliance Code unknown
HTS Code 8542.39.00.01
ECCN Code EAR99

XCV600E-7FGG676C Datasheet Download


XCV600E-7FGG676C Overview



The XCV600E-7FGG676C is a powerful chip model that can be used for a variety of applications, such as high-performance digital signal processing, embedded processing, and image processing. It requires the use of HDL language, which is a hardware description language used to program digital logic circuits. This chip model is suitable for developing and popularizing future intelligent robots, as it can provide the necessary processing power and accuracy.


The XCV600E-7FGG676C has a wide range of features, including a 32-bit RISC processor, a high-speed memory interface, and a high-speed serial interface. It also has a built-in FPGA, which can be used to customize the chip for specific applications. The chip also has a wide range of peripherals, such as USB, Ethernet, and CAN bus, which can be used for communication and data transfer.


The product description and specific design requirements of the XCV600E-7FGG676C should be carefully studied in order to use the chip effectively. It is important to understand the various features of the chip and how to use them in order to maximize its potential. For example, the chip's memory interface can be used to store large amounts of data and the FPGA can be used to customize the chip for specific applications.


In order to use the XCV600E-7FGG676C effectively, certain technical talents are needed. For example, a thorough understanding of HDL language is necessary in order to program the chip. In addition, knowledge of the chip's various features and peripherals is also necessary in order to take full advantage of the chip's potential.


Case studies involving the XCV600E-7FGG676C can provide valuable insight into how the chip can be used effectively. It is also important to consider the potential risks associated with using the chip, such as the possibility of data corruption or system crashes.


In conclusion, the XCV600E-7FGG676C is a powerful chip model that can be used for a variety of applications, including developing and popularizing future intelligent robots. In order to use the chip effectively, certain technical talents are needed, such as knowledge of HDL language and the chip's various features and peripherals. Case studies and potential risks should also be taken into consideration.



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