
AMD Xilinx
XCV600E-7BG560I
XCV600E-7BG560I ECAD Model
XCV600E-7BG560I Attributes
Type | Description | Select |
---|---|---|
Mfr | AMD Xilinx | |
Series | Virtex®-E | |
Package | Tray | |
Number of LABs/CLBs | 3456 | |
Number of Logic Elements/Cells | 15552 | |
Total RAM Bits | 294912 | |
Number of I/O | 404 | |
Number of Gates | 985882 | |
Voltage - Supply | 1.71V ~ 1.89V | |
Mounting Type | Surface Mount | |
Operating Temperature | -40°C ~ 100°C (TJ) | |
Package / Case | 560-LBGA Exposed Pad, Metal | |
Supplier Device Package | 560-MBGA (42.5x42.5) | |
Base Product Number | XCV600E |
XCV600E-7BG560I Datasheet Download
XCV600E-7BG560I Overview
The XCV600E-7BG560I is a Field Programmable Gate Array (FPGA) chip manufactured by Xilinx. It belongs to the Virtex-6 family and is designed for high-end applications. The chip features a 7-series FPGA architecture and is built using a low-power, low-cost 40nm process. It has a total of 560 I/O pins, which can be configured as LVDS, LVCMOS, and GTL+ or GTH+ interfaces.
The XCV600E-7BG560I has a maximum operating frequency of 600MHz and a total of 8.4 million logic cells. It also features an integrated DSP block, which can be used for high-speed signal processing. Additionally, the chip has an embedded Block RAM of 33.6 Mbits and a total of 664 18x18 multipliers. Furthermore, the chip supports various I/O standards, such as PCI Express, USB, Ethernet, and SATA.
The XCV600E-7BG560I is suitable for a wide range of applications, including communications, networking, image processing, medical imaging, and embedded systems. It is ideal for high-performance applications that require low power consumption, high speed, and low cost. The chip is also suitable for applications that require high levels of integration, such as digital signal processing and high-speed data transfer.
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