XCV600E-7BG560C
XCV600E-7BG560C
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AMD Xilinx

XCV600E-7BG560C


XCV600E-7BG560C
F20-XCV600E-7BG560C
Active
IC FPGA 404 I/O 560MBGA
560-MBGA (42.5x42.5)

XCV600E-7BG560C ECAD Model


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XCV600E-7BG560C Attributes


Type Description Select
Mfr AMD Xilinx
Series Virtex®-E
Package Tray
Number of LABs/CLBs 3456
Number of Logic Elements/Cells 15552
Total RAM Bits 294912
Number of I/O 404
Number of Gates 985882
Voltage - Supply 1.71V ~ 1.89V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 560-LBGA Exposed Pad, Metal
Supplier Device Package 560-MBGA (42.5x42.5)
Base Product Number XCV600E

XCV600E-7BG560C Datasheet Download


XCV600E-7BG560C Overview



The XCV600E-7BG560C is a Field Programmable Gate Array (FPGA) chip manufactured by Xilinx, Inc. It is a mid-range, low power, high performance FPGA chip that is designed for use in a wide variety of applications.


The XCV600E-7BG560C is a high-density FPGA chip with a total of 560,000 logic cells. It has a maximum clock frequency of 250MHz, and a maximum operating temperature of 105°C. It also features a multi-gigabit transceiver (MGT) with a data rate of up to 12.5Gbps. The chip also features a high-speed memory interface for up to 1GB of DDR3 SDRAM.


The XCV600E-7BG560C is designed for use in a variety of applications, including embedded systems, industrial control systems, medical devices, and automotive applications. It is also suitable for use in high-performance computing, networking, and video applications.


In summary, the XCV600E-7BG560C is a mid-range, low power, high performance FPGA chip with a total of 560,000 logic cells and a maximum clock frequency of 250MHz. It features a multi-gigabit transceiver and a high-speed memory interface, making it suitable for a wide range of applications, including embedded systems, industrial control systems, medical devices, automotive applications, high-performance computing, networking, and video applications.



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