AMD Xilinx
XCV600E-6FGG676C
XCV600E-6FGG676C ECAD Model
XCV600E-6FGG676C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 444 | |
| Number of Outputs | 444 | |
| Number of Logic Cells | 15552 | |
| Number of Equivalent Gates | 186624 | |
| Number of CLBs | 3456 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 3456 CLBS, 186624 GATES | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B676 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 676 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA676,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-676 | |
| Pin Count | 676 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XCV600E-6FGG676C Datasheet Download
XCV600E-6FGG676C Overview
The XCV600E-6FGG676C chip model is a powerful and reliable solution for high-performance digital signal processing, embedded processing, and image processing. It is designed with the HDL language, offering great flexibility and scalability for various applications. Its advanced features make it the ideal choice for a variety of industries, from communications to aerospace and defense.
The XCV600E-6FGG676C is designed to meet the demands of the ever-evolving digital world. It is capable of handling complex tasks with ease and offers advanced features such as low power consumption, high speed, and low latency. The chip also supports multiple processor cores, allowing for efficient parallel processing and scalability.
The original design intention of the XCV600E-6FGG676C was to provide a reliable and powerful platform for digital signal processing, embedded processing, and image processing. It is designed to be easily upgradable, allowing for future upgrades and improvements. The chip can also be used in advanced communication systems, offering support for new technologies such as 5G, Wi-Fi 6, and more.
The XCV600E-6FGG676C chip model is a great solution for industries that require high-performance digital signal processing, embedded processing, and image processing. Its advanced features make it the perfect choice for a variety of applications, from communications to aerospace and defense. With its upgradable design, the XCV600E-6FGG676C can be used in a variety of advanced communication systems and will be able to keep up with the ever-evolving digital world.
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2,879 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $33.4940 | $33.4940 |
| 10+ | $33.1338 | $331.3380 |
| 100+ | $31.3331 | $3,133.3050 |
| 1000+ | $29.5323 | $14,766.1500 |
| 10000+ | $27.0113 | $27,011.2500 |
| The price is for reference only, please refer to the actual quotation! | ||