XCV600E-6FG676I

The XCV600E-6FG676I is a high-performance, low-power, 6-stage pipelined, embedded FPGA chip from Xilinx. It is designed to provide a cost-effective solution for applications requiring high-speed and low-power operation.

The XCV600E-6FG676I features a 6-stage pipelined architecture and is built on a 65-nm process technology. It has a capacity of up to 676K logic cells, 676Kbits of block RAM, and 288 DSP slices. It supports up to 676Kbits of distributed RAM and up to 676Kbits of distributed ROM. It also supports up to 676Kbits of distributed clock management.

The XCV600E-6FG676I is designed to provide a high-speed and low-power solution for embedded applications. It can be used in a variety of applications including automotive, industrial, consumer, and medical. It is well-suited for applications such as motor control, audio/video processing, image processing, and communications.

The XCV600E-6FG676I has a power consumption of less than 1.5W. It is also designed to be compliant with the RoHS and WEEE standards. The chip is available in a variety of packages, including BGA, LQFP, and PQFP.

Overall, the XCV600E-6FG676I is a high-performance, low-power, 6-stage pipelined embedded FPGA chip from Xilinx. It is designed to provide a cost-effective solution for applications requiring high-speed and low-power operation. It is well-suited for a variety of embedded applications, including automotive, industrial, consumer, and medical.