AMD Xilinx
XCV600E-6BGG432I
XCV600E-6BGG432I ECAD Model
XCV600E-6BGG432I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 316 | |
| Number of Outputs | 316 | |
| Number of Logic Cells | 15552 | |
| Number of Equivalent Gates | 186624 | |
| Number of CLBs | 3456 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 3456 CLBS, 186624 GATES | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B432 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 432 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA432,31X31,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA-432 | |
| Pin Count | 432 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
XCV600E-6BGG432I Datasheet Download
XCV600E-6BGG432I Overview
The XCV600E-6BGG432I is a chip model designed for high-performance digital signal processing, embedded processing, and image processing. As such, it requires the use of HDL language for programming. With its powerful capabilities, the XCV600E-6BGG432I is well-suited for a variety of applications, from basic to advanced.
In terms of industry trends, the XCV600E-6BGG432I is a versatile chip that can be used in many different fields. It can be used in communication systems, image processing, and other applications. As the technology advances, the XCV600E-6BGG432I can be adapted to new technologies and upgraded to meet the demands of the industry.
The original design intention of the XCV600E-6BGG432I was to provide a powerful solution for digital signal processing, embedded processing, and image processing. It was designed to be flexible and adaptable to different applications and environments. The XCV600E-6BGG432I can be easily upgraded to meet the needs of the industry.
The XCV600E-6BGG432I is a powerful chip model that can be used in a variety of applications. It is suitable for high-performance digital signal processing, embedded processing, and image processing. It can be used in advanced communication systems, as well as other applications where new technologies are required. The XCV600E-6BGG432I is designed to be flexible and can be easily upgraded to meet the demands of the industry. With its powerful capabilities, the XCV600E-6BGG432I is an excellent choice for a variety of applications.
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