AMD Xilinx
XCV600E-6BGG432C
XCV600E-6BGG432C ECAD Model
XCV600E-6BGG432C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 316 | |
| Number of Outputs | 316 | |
| Number of Logic Cells | 15552 | |
| Number of Equivalent Gates | 186624 | |
| Number of CLBs | 3456 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 3456 CLBS, 186624 GATES | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B432 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 432 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA432,31X31,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA-432 | |
| Pin Count | 432 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XCV600E-6BGG432C Datasheet Download
XCV600E-6BGG432C Overview
The chip model XCV600E-6BGG432C is a cutting-edge integrated circuit that has been developed to meet the demands of today's rapidly evolving technology landscape. This chip model offers a range of advantages that make it particularly suitable for use in a variety of industries. It is designed to provide high levels of performance, reliability, and scalability, making it an ideal choice for both existing and emerging applications.
The XCV600E-6BGG432C chip model is designed to provide superior performance in terms of speed, power consumption, and cost. It is capable of supporting a wide range of applications, including high-speed data transmission, digital signal processing, and artificial intelligence. It also offers advanced features such as low-power operation, high-speed data transfer, and error correction. The chip model is also highly scalable, meaning it can be used in a variety of applications without requiring significant hardware modifications.
The XCV600E-6BGG432C chip model is expected to be in high demand in the coming years, as the demand for faster, more efficient, and more reliable technology continues to increase. It is likely to be particularly popular in the networking industry, as its ability to support high-speed data transfer and low-power operation is highly desirable. It is also likely to be used in a range of intelligent scenarios, such as autonomous vehicles, smart homes, and industrial automation. The chip model is also likely to be a popular choice for the era of fully intelligent systems, as its scalability and advanced features make it an ideal choice for such applications.
The XCV600E-6BGG432C chip model is designed to meet the needs of a wide range of applications and industries. It is designed to provide superior performance in terms of speed, power consumption, and cost. It is also designed to be highly scalable, meaning it can be used in a variety of applications without requiring significant hardware modifications. Additionally, it is designed to be highly reliable, meaning it can be used in a wide range of applications without compromising on performance.
When using the XCV600E-6BGG432C chip model, it is important to consider the specific design requirements of the application. This includes factors such as the power requirements, data rate, and the environment in which the chip will be used. Additionally, it is important to ensure that the chip is properly tested and calibrated to ensure optimal performance. It is also important to consider any potential safety or security risks associated with using the chip model, as well as any potential compatibility issues with other hardware or software.
In conclusion, the chip model XCV600E-6BGG432C is an advanced integrated circuit that offers a range of advantages that make it particularly suitable for use in a variety of industries. It is designed to provide superior performance in terms of speed, power consumption, and cost, making it an ideal choice for both existing and emerging applications. It is expected to be in high demand in the coming years, as the demand for faster, more efficient, and more reliable technology continues to increase. When using the XCV600E-6BGG432C chip model, it is important to consider the specific design requirements of the application, as well as any potential safety or security risks associated with using the chip model.
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5,561 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $279.0000 | $279.0000 |
| 10+ | $276.0000 | $2,760.0000 |
| 100+ | $261.0000 | $26,100.0000 |
| 1000+ | $246.0000 | $123,000.0000 |
| 10000+ | $225.0000 | $225,000.0000 |
| The price is for reference only, please refer to the actual quotation! | ||