XCV600E-6BG560C
XCV600E-6BG560C
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AMD Xilinx

XCV600E-6BG560C


XCV600E-6BG560C
F20-XCV600E-6BG560C
Active
IC FPGA 404 I/O 560MBGA
560-MBGA (42.5x42.5)

XCV600E-6BG560C ECAD Model


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XCV600E-6BG560C Attributes


Type Description Select
Mfr AMD Xilinx
Series Virtex®-E
Package Tray
Number of LABs/CLBs 3456
Number of Logic Elements/Cells 15552
Total RAM Bits 294912
Number of I/O 404
Number of Gates 985882
Voltage - Supply 1.71V ~ 1.89V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 560-LBGA Exposed Pad, Metal
Supplier Device Package 560-MBGA (42.5x42.5)
Base Product Number XCV600E

XCV600E-6BG560C Datasheet Download


XCV600E-6BG560C Overview



The XCV600E-6BG560C is a high-performance, low-power, and low-cost field-programmable gate array (FPGA) chip manufactured by Xilinx. It is designed to provide a wide range of functions in a single device, including logic, memory, and digital signal processing (DSP) capabilities. It is also capable of supporting high-speed serial communications, such as Ethernet, USB, and PCI Express.


The XCV600E-6BG560C is based on the Virtex-6 family of FPGAs, which are designed to deliver high performance and low power consumption. It features a total of 6,560 logic cells and 5,600 DSP slices, as well as embedded memory blocks and dedicated hard multipliers for increased performance. It also includes up to four high-speed transceivers, which can support data rates up to 6.5 Gbps.


The XCV600E-6BG560C is suitable for a wide range of applications, such as high-performance computing, video and image processing, communications, and automotive systems. It can also be used to create custom logic designs, as well as for prototyping and system integration.


In summary, the XCV600E-6BG560C is a powerful and versatile FPGA chip designed to provide a wide range of functions and capabilities in a single device. It is suitable for a wide range of applications, including high-performance computing, video and image processing, communications, and automotive systems.



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