
AMD Xilinx
XCV600-6FGG676C
XCV600-6FGG676C ECAD Model
XCV600-6FGG676C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 2.5 V | |
Number of Equivalent Gates | 661111 | |
Number of CLBs | 3456 | |
Combinatorial Delay of a CLB-Max | 600 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 3456 CLBS, 661111 GATES | |
Clock Frequency-Max | 333 MHz | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
JESD-30 Code | S-PBGA-B676 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 250 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 676 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 27 mm | |
Length | 27 mm | |
Seated Height-Max | 2.6 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA, | |
Pin Count | 676 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XCV600-6FGG676C Datasheet Download
XCV600-6FGG676C Overview
The XCV600-6FGG676C chip model is an advanced integrated circuit (IC) designed to provide high-performance, low-power consumption, and reliable operation in a wide range of applications. It is an ideal choice for those who need to build advanced communication systems and networks.
The XCV600-6FGG676C was designed with the intention of providing a high level of performance while also reducing power consumption. Its features include a high-speed, low-power, low-noise operation, and a wide range of integrated functions such as a digital signal processor, a programmable logic array, and an analog-to-digital converter. This chip is capable of performing various tasks such as data processing, image processing, and audio processing.
The XCV600-6FGG676C can be used in a variety of applications, including wireless communication networks, intelligent systems, and industrial automation. It is suitable for use in the era of fully intelligent systems, as it can be used to control and monitor a wide range of intelligent devices and systems. Its low power consumption makes it an ideal choice for applications that require low power consumption.
The product description and specific design requirements of the XCV600-6FGG676C chip model include its operating frequency, power consumption, and various integrated functions. Its operating frequency can range from 0.2 GHz to 1.2 GHz, and its power consumption can range from 0.5 W to 1.5 W. Its integrated functions include a digital signal processor, a programmable logic array, and an analog-to-digital converter.
In addition, the XCV600-6FGG676C chip model can be upgraded to improve its performance. For example, the chip can be upgraded to support the latest communication protocols and technologies, such as 5G. This will enable the chip to be used in more advanced communication systems.
Case studies have been conducted to evaluate the performance of the XCV600-6FGG676C chip model. The results of these studies have shown that the chip is capable of providing reliable performance while consuming minimal power.
When using the XCV600-6FGG676C chip model, it is important to take into account the potential risks associated with its use. For example, it is important to ensure that the chip is properly installed and configured, and that it is not exposed to any extreme temperatures or conditions. Additionally, it is important to ensure that the chip is compatible with the system it is being used in, and that any necessary software updates are applied.
In conclusion, the XCV600-6FGG676C chip model is an advanced integrated circuit designed to provide high-performance, low-power consumption, and reliable operation in a wide range of applications. It can be used in a variety of applications, including wireless communication networks, intelligent systems, and industrial automation. Its features include a high-speed, low-power, low-noise operation, and a wide range of integrated functions. The chip can be upgraded to improve its performance, and case studies have shown that the chip is capable of providing reliable performance while consuming minimal power. When using the XCV600-6FGG676C chip model, it is important to take into account the potential risks associated with its use.
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