AMD Xilinx
XCV600-6FG676I
XCV600-6FG676I ECAD Model
XCV600-6FG676I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 444 | |
| Number of Outputs | 444 | |
| Number of Logic Cells | 15552 | |
| Number of Equivalent Gates | 661111 | |
| Number of CLBs | 3456 | |
| Combinatorial Delay of a CLB-Max | 600 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 3456 CLBS, 661111 GATES | |
| Clock Frequency-Max | 333 MHz | |
| Power Supplies | 1.2/3.6,2.5 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B676 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 676 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA676,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-676 | |
| Pin Count | 676 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XCV600-6FG676I Datasheet Download
XCV600-6FG676I Overview
The XCV600-6FG676I chip model is a powerful and versatile processor designed to meet the needs of many high-performance applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language. This chip model is designed to provide superior performance and robustness in a variety of applications.
The XCV600-6FG676I chip model offers a range of advantages that make it an attractive choice for applications in many industries. It offers high-performance processing, allowing for faster completion of tasks and more efficient use of resources. Additionally, its advanced design allows for better power management, making it a great choice for applications that require low power consumption. Furthermore, its robust architecture ensures reliable operation and a long lifespan.
The XCV600-6FG676I chip model is expected to be in high demand in the future, as more and more applications are developed that require its capabilities. With its superior performance and power management capabilities, the chip model is well-suited for use in a wide range of applications, from embedded systems to advanced communication systems. Additionally, its robust architecture makes it suitable for use in mission-critical applications, where reliability and longevity are essential.
The original design intention of the XCV600-6FG676I chip model was to provide superior performance and robustness in a variety of applications. This was achieved by combining advanced hardware and software design techniques to create a powerful processor capable of handling demanding tasks. Additionally, the design allows for future upgrades and improvements, making it a great choice for applications that require frequent updates or modifications.
The XCV600-6FG676I chip model is a powerful and versatile processor capable of handling complex tasks. It is suitable for use in high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language. Its superior performance and power management capabilities make it an attractive choice for applications in many industries. Additionally, its robust architecture makes it suitable for use in mission-critical applications, and its design allows for future upgrades and improvements. As such, the XCV600-6FG676I chip model is expected to be in high demand in the future, and is well-suited for use in advanced communication systems.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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