AMD Xilinx
XCV600-6BGG560I
XCV600-6BGG560I ECAD Model
XCV600-6BGG560I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 661111 | |
| Number of CLBs | 3456 | |
| Combinatorial Delay of a CLB-Max | 600 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 3456 CLBS, 661111 GATES | |
| Clock Frequency-Max | 333 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LBGA, | |
| Pin Count | 560 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV600-6BGG560I Datasheet Download
XCV600-6BGG560I Overview
The chip model XCV600-6BGG560I is a new model of integrated circuit that has been developed to meet the needs of modern communication systems. It is designed to be an efficient and reliable solution for a variety of applications, such as high-speed data transmission, digital signal processing, and wireless communication.
The XCV600-6BGG560I is built on a 28nm CMOS process and is capable of operating at up to 1.2GHz. It has a high level of integration and includes a variety of features, such as a low-power design, a wide range of analog and digital interfaces, and a variety of power management functions. The chip supports various communication protocols, such as Wi-Fi, Bluetooth, and Zigbee, and is designed to be compatible with a variety of operating systems.
The XCV600-6BGG560I is designed to be a reliable and efficient solution for a variety of communication applications. It is designed to be compatible with a wide range of operating systems, and can be used for both wired and wireless communication. The chip also supports a variety of communication protocols, such as Wi-Fi, Bluetooth, and Zigbee, as well as a variety of power management functions.
In terms of industry trends, the XCV600-6BGG560I is a part of the growing trend of integrated circuit designs that are becoming increasingly complex and powerful. As technology advances and the need for faster and more reliable communication systems increases, the chip model is likely to become even more powerful and efficient.
In terms of future upgrades, the XCV600-6BGG560I is designed to be upgradable and can be used in a variety of communication systems. It is also designed to be compatible with a variety of operating systems and can be used in both wired and wireless communication. The chip is designed to be reliable and efficient, and is capable of operating at up to 1.2GHz.
In terms of product description, the XCV600-6BGG560I is a 28nm CMOS process chip that is designed to be an efficient and reliable solution for a variety of communication applications. It is designed to be compatible with a wide range of operating systems, and can be used for both wired and wireless communication. The chip also supports a variety of communication protocols, such as Wi-Fi, Bluetooth, and Zigbee, as well as a variety of power management functions.
In terms of specific design requirements, the XCV600-6BGG560I is designed to be a reliable and efficient solution for a variety of communication applications. It is designed to be compatible with a wide range of operating systems, and can be used for both wired and wireless communication. The chip also supports a variety of communication protocols, such as Wi-Fi, Bluetooth, and Zigbee, as well as a variety of power management functions.
In terms of actual case studies, the XCV600-6BGG560I has been used in a variety of applications, such as high-speed data transmission, digital signal processing, and wireless communication. It is designed to be an efficient and reliable solution for a variety of communication applications, and has been used in a variety of applications, such as medical, automotive, and industrial applications.
In terms of precautions, the XCV600-6BGG560I is designed to be a reliable and efficient solution for a variety of communication applications. However, it is important to ensure that the chip is used in an appropriate environment and that the correct operating systems and protocols are used. It is also important to ensure that the chip is used in a suitable environment and that the correct power management functions are used.
Overall, the XCV600-6BGG560I is a reliable and efficient solution for a variety of communication applications. It is designed to be compatible with a wide range of operating systems, and can be used for both wired and wireless communication. The chip also supports a variety of communication protocols, such as Wi-Fi, Bluetooth, and Zigbee, as well as a variety of power management functions. In terms of industry trends and future development, the XCV600-6BGG560I is likely to become even more powerful and efficient as technology advances and the need for faster and more reliable communication systems increases.
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4,081 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $735.1605 | $735.1605 |
| 10+ | $727.2556 | $7,272.5558 |
| 100+ | $687.7308 | $68,773.0824 |
| 1000+ | $648.2061 | $324,103.0320 |
| 10000+ | $592.8714 | $592,871.4000 |
| The price is for reference only, please refer to the actual quotation! | ||