XCV600-6BGG560C
XCV600-6BGG560C
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rohs

AMD Xilinx

XCV600-6BGG560C


XCV600-6BGG560C
F20-XCV600-6BGG560C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, LBGA
LBGA

XCV600-6BGG560C ECAD Model


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XCV600-6BGG560C Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 2.5 V
Number of Equivalent Gates 661111
Number of CLBs 3456
Combinatorial Delay of a CLB-Max 600 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 3456 CLBS, 661111 GATES
Clock Frequency-Max 333 MHz
Supply Voltage-Max 2.625 V
Supply Voltage-Min 2.375 V
JESD-30 Code S-PBGA-B560
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 560
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 42.5 mm
Length 42.5 mm
Seated Height-Max 1.7 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description LBGA,
Pin Count 560
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XCV600-6BGG560C Datasheet Download


XCV600-6BGG560C Overview



The chip model XCV600-6BGG560C is a high-performance chip designed to meet the needs of modern networks and intelligent systems. It is a versatile chip that can be used in a variety of scenarios and applications, ranging from basic network infrastructure to intelligent robotics.


In terms of its possible future applications, the XCV600-6BGG560C is capable of providing high-speed data processing and transmission, as well as allowing for the development of intelligent systems. It can be used to create intelligent robots that are capable of performing complex tasks, such as navigation and object recognition. It also has the potential to be used in the era of fully intelligent systems, such as autonomous vehicles and robotics.


The product description and specific design requirements of the XCV600-6BGG560C are detailed in its technical specifications. It is designed to be a powerful and reliable chip, capable of handling large amounts of data and providing high-speed data transmission. It is also designed to be energy efficient, allowing for long-term use without draining too much power.


To ensure its effective use, it is important to understand the chip model's technical specifications, as well as its possible applications and limitations. This can be done through case studies and experiments, which can help to identify the best ways to use the chip model for specific applications. Additionally, it is important to be aware of any potential safety risks associated with the chip model, as well as any precautions that should be taken when using it.


In addition to understanding its technical specifications and possible applications, it is also important to consider the technical talents that are needed to use the chip model effectively. This includes knowledge of programming languages such as C++, as well as a good understanding of robotics and artificial intelligence. Additionally, knowledge of electrical engineering and networking may also be necessary in order to use the chip model in an effective way.


Overall, the XCV600-6BGG560C chip model is a powerful and versatile chip that can be used in a variety of applications. It has the potential to be used in the development and popularization of future intelligent robots, as well as in the era of fully intelligent systems. In order to use the chip model effectively, it is important to understand its technical specifications, possible applications, and any safety risks associated with it. Additionally, it is important to consider the technical talents that are necessary to use the chip model effectively.



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