AMD Xilinx
XCV600-5FGG680I
XCV600-5FGG680I ECAD Model
XCV600-5FGG680I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 661111 | |
| Number of CLBs | 3456 | |
| Combinatorial Delay of a CLB-Max | 700 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 3456 CLBS, 661111 GATES | |
| Clock Frequency-Max | 294 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B680 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 680 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LBGA, | |
| Pin Count | 680 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV600-5FGG680I Datasheet Download
XCV600-5FGG680I Overview
The XCV600-5FGG680I chip model is a revolutionary product designed to meet the ever-changing demands of the modern world. This model is an advanced integrated chip that is capable of providing high-speed and reliable performance across a wide range of applications. It is also capable of providing reliable support for a variety of communication systems, networks, and intelligent scenarios.
The XCV600-5FGG680I chip model is designed to provide enhanced performance, reliability, and flexibility compared to the previous generation of chips. It is capable of providing high-speed communication, data processing, and storage capabilities. It is also capable of providing support for a variety of communication systems, networks, and intelligent scenarios.
The XCV600-5FGG680I chip model is also designed to be upgradeable and able to adapt to the changing needs of the modern world. It is designed to be able to be upgraded to the next generation of chips, allowing users to take advantage of the latest advancements in technology. This chip model is also designed to be able to be used in the era of fully intelligent systems, allowing it to be used in a variety of intelligent scenarios.
The XCV600-5FGG680I chip model has a number of advantages that make it an attractive choice for many industries. It is capable of providing high-speed and reliable performance across a wide range of applications. It is also capable of providing reliable support for a variety of communication systems, networks, and intelligent scenarios. Additionally, it is designed to be upgradeable and able to adapt to the changing needs of the modern world.
Given the advantages of the XCV600-5FGG680I chip model, it is expected that demand for this model will continue to grow in the future. This chip model is an attractive option for a variety of industries due to its high-speed and reliable performance, its upgradeability, and its ability to be used in a variety of intelligent scenarios. As the demand for advanced communication systems, networks, and intelligent scenarios continues to grow, the XCV600-5FGG680I chip model is likely to remain a popular choice for many industries.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||