AMD Xilinx
XCV600-5FGG680C
XCV600-5FGG680C ECAD Model
XCV600-5FGG680C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 661111 | |
| Number of CLBs | 3456 | |
| Combinatorial Delay of a CLB-Max | 700 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 3456 CLBS, 661111 GATES | |
| Clock Frequency-Max | 294 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B680 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 680 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LBGA, | |
| Pin Count | 680 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV600-5FGG680C Datasheet Download
XCV600-5FGG680C Overview
The XCV600-5FGG680C chip model is a revolutionary new product that has been designed to provide a wide range of powerful features and capabilities for a variety of industries and applications. It is a highly advanced model that is capable of delivering superior performance, reliability, and cost-effectiveness.
The XCV600-5FGG680C chip model offers a number of distinct advantages that make it an attractive choice for many industries. It is equipped with a powerful processor, a large memory capacity, and a wide range of communication interfaces. This allows it to be used in a variety of applications, from industrial automation to medical imaging. It also has a low power consumption and a low heat dissipation, making it ideal for use in energy-efficient systems.
The XCV600-5FGG680C chip model is expected to see a significant increase in demand in the near future. This is due to its ability to provide a wide range of features and capabilities for a variety of industries and applications. For example, it can be used in industrial automation, medical imaging, and even in the development of intelligent robots.
The XCV600-5FGG680C chip model can be used in networks and intelligent scenarios, such as autonomous vehicles, smart homes, and smart factories. It is also capable of being used in the era of fully intelligent systems, such as the Internet of Things. It is also capable of being used in the development and popularization of future intelligent robots.
In order to effectively use the XCV600-5FGG680C chip model, a certain level of technical knowledge is required. This includes a basic understanding of computer programming, electronics, and robotics. Additionally, knowledge of the specific application that the chip model is being used for is also important. It is important to have a thorough understanding of the features and capabilities of the chip model in order to make the most effective use of it.
In conclusion, the XCV600-5FGG680C chip model is a revolutionary new product that offers a wide range of features and capabilities for a variety of industries and applications. It is expected to see a significant increase in demand in the near future due to its ability to provide a wide range of features and capabilities. It can be used in networks and intelligent scenarios, such as autonomous vehicles, smart homes, and smart factories. It is also capable of being used in the development and popularization of future intelligent robots. In order to effectively use the XCV600-5FGG680C chip model, a certain level of technical knowledge is required.
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