XCV600-5FGG676I
XCV600-5FGG676I
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rohs

AMD Xilinx

XCV600-5FGG676I


XCV600-5FGG676I
F20-XCV600-5FGG676I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, BGA
BGA

XCV600-5FGG676I ECAD Model


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XCV600-5FGG676I Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 2.5 V
Number of Equivalent Gates 661111
Number of CLBs 3456
Combinatorial Delay of a CLB-Max 700 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Organization 3456 CLBS, 661111 GATES
Clock Frequency-Max 294 MHz
Supply Voltage-Max 2.625 V
Supply Voltage-Min 2.375 V
JESD-30 Code S-PBGA-B676
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 676
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 2.6 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description BGA,
Pin Count 676
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XCV600-5FGG676I Datasheet Download


XCV600-5FGG676I Overview



The XCV600-5FGG676I chip model is a high-performance digital signal processing, embedded processing, and image processing chip that is designed to be used with HDL language. This chip is capable of performing complex calculations that are required for high-end applications, making it a great choice for a wide range of scenarios.


The XCV600-5FGG676I chip model can be used in networks, allowing for the transmission of data across multiple devices. It can also be used in intelligent scenarios, such as machine learning and artificial intelligence, as it is capable of performing complex calculations in a short amount of time. Additionally, it can be used in the era of fully intelligent systems, as it is capable of performing the necessary calculations to enable the development of fully automated systems.


The product description of the XCV600-5FGG676I chip model includes its features, such as its high-performance digital signal processing and embedded processing capabilities. It also includes its design requirements, such as the use of HDL language. Additionally, actual case studies and precautions should be taken into account when using the XCV600-5FGG676I chip model.


Overall, the XCV600-5FGG676I chip model is a great choice for a wide range of applications, including intelligent scenarios and fully automated systems. Its features and design requirements must be taken into account when using the chip model, and actual case studies and precautions should be taken into account as well. With its high-performance capabilities, the XCV600-5FGG676I chip model is sure to be a great choice for a variety of applications.



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