
AMD Xilinx
XCV600-5FGG676I
XCV600-5FGG676I ECAD Model
XCV600-5FGG676I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 2.5 V | |
Number of Equivalent Gates | 661111 | |
Number of CLBs | 3456 | |
Combinatorial Delay of a CLB-Max | 700 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 3456 CLBS, 661111 GATES | |
Clock Frequency-Max | 294 MHz | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
JESD-30 Code | S-PBGA-B676 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Peak Reflow Temperature (Cel) | 250 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 676 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 27 mm | |
Length | 27 mm | |
Seated Height-Max | 2.6 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA, | |
Pin Count | 676 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XCV600-5FGG676I Datasheet Download
XCV600-5FGG676I Overview
The XCV600-5FGG676I chip model is a high-performance digital signal processing, embedded processing, and image processing chip that is designed to be used with HDL language. This chip is capable of performing complex calculations that are required for high-end applications, making it a great choice for a wide range of scenarios.
The XCV600-5FGG676I chip model can be used in networks, allowing for the transmission of data across multiple devices. It can also be used in intelligent scenarios, such as machine learning and artificial intelligence, as it is capable of performing complex calculations in a short amount of time. Additionally, it can be used in the era of fully intelligent systems, as it is capable of performing the necessary calculations to enable the development of fully automated systems.
The product description of the XCV600-5FGG676I chip model includes its features, such as its high-performance digital signal processing and embedded processing capabilities. It also includes its design requirements, such as the use of HDL language. Additionally, actual case studies and precautions should be taken into account when using the XCV600-5FGG676I chip model.
Overall, the XCV600-5FGG676I chip model is a great choice for a wide range of applications, including intelligent scenarios and fully automated systems. Its features and design requirements must be taken into account when using the chip model, and actual case studies and precautions should be taken into account as well. With its high-performance capabilities, the XCV600-5FGG676I chip model is sure to be a great choice for a variety of applications.
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