XCV600-5FGG676C
XCV600-5FGG676C
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rohs

AMD Xilinx

XCV600-5FGG676C


XCV600-5FGG676C
F20-XCV600-5FGG676C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, BGA
BGA

XCV600-5FGG676C ECAD Model


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XCV600-5FGG676C Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 2.5 V
Number of Equivalent Gates 661111
Number of CLBs 3456
Combinatorial Delay of a CLB-Max 700 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 3456 CLBS, 661111 GATES
Clock Frequency-Max 294 MHz
Supply Voltage-Max 2.625 V
Supply Voltage-Min 2.375 V
JESD-30 Code S-PBGA-B676
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 676
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 2.6 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description BGA,
Pin Count 676
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XCV600-5FGG676C Datasheet Download


XCV600-5FGG676C Overview



The XCV600-5FGG676C chip model is a powerful tool for digital signal processing, embedded processing, and image processing. It is designed to handle high-performance tasks, making it an ideal choice for a wide range of applications. The model is programmed using the HDL language, allowing users to customize their applications to their specific needs.


The XCV600-5FGG676C chip model offers a number of advantages, including high speed, low power consumption, and low latency. These features make it suitable for a variety of applications, from industrial and medical to consumer electronics. Additionally, the model is extremely scalable, meaning that it can be used for a variety of tasks, from basic to complex.


The XCV600-5FGG676C chip model is expected to see increased demand in the coming years, as more applications require its capabilities. In particular, the model is well suited for use in network-related applications, such as 5G and IoT. Additionally, the model can be used in intelligent scenarios, such as autonomous vehicles, robotics, and AI. As the world moves towards a fully intelligent future, the XCV600-5FGG676C chip model will be an invaluable asset.


The XCV600-5FGG676C chip model is a powerful tool that can be used for a variety of applications. Its high speed, low power consumption, and low latency make it well-suited for network-related applications and intelligent scenarios. As the world moves towards a fully intelligent future, the XCV600-5FGG676C chip model will be an invaluable asset, allowing users to customize their applications to their specific needs.



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