
AMD Xilinx
XCV600-5FGG676C
XCV600-5FGG676C ECAD Model
XCV600-5FGG676C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 2.5 V | |
Number of Equivalent Gates | 661111 | |
Number of CLBs | 3456 | |
Combinatorial Delay of a CLB-Max | 700 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 3456 CLBS, 661111 GATES | |
Clock Frequency-Max | 294 MHz | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
JESD-30 Code | S-PBGA-B676 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 250 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 676 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 27 mm | |
Length | 27 mm | |
Seated Height-Max | 2.6 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA, | |
Pin Count | 676 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XCV600-5FGG676C Datasheet Download
XCV600-5FGG676C Overview
The XCV600-5FGG676C chip model is a powerful tool for digital signal processing, embedded processing, and image processing. It is designed to handle high-performance tasks, making it an ideal choice for a wide range of applications. The model is programmed using the HDL language, allowing users to customize their applications to their specific needs.
The XCV600-5FGG676C chip model offers a number of advantages, including high speed, low power consumption, and low latency. These features make it suitable for a variety of applications, from industrial and medical to consumer electronics. Additionally, the model is extremely scalable, meaning that it can be used for a variety of tasks, from basic to complex.
The XCV600-5FGG676C chip model is expected to see increased demand in the coming years, as more applications require its capabilities. In particular, the model is well suited for use in network-related applications, such as 5G and IoT. Additionally, the model can be used in intelligent scenarios, such as autonomous vehicles, robotics, and AI. As the world moves towards a fully intelligent future, the XCV600-5FGG676C chip model will be an invaluable asset.
The XCV600-5FGG676C chip model is a powerful tool that can be used for a variety of applications. Its high speed, low power consumption, and low latency make it well-suited for network-related applications and intelligent scenarios. As the world moves towards a fully intelligent future, the XCV600-5FGG676C chip model will be an invaluable asset, allowing users to customize their applications to their specific needs.
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