XCV600-5FG676C
XCV600-5FG676C
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AMD Xilinx

XCV600-5FG676C


XCV600-5FG676C
F20-XCV600-5FG676C
Active
IC FPGA 444 I/O 676FCBGA
676-FBGA (27x27)

XCV600-5FG676C ECAD Model


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XCV600-5FG676C Attributes


Type Description Select
Mfr AMD Xilinx
Series Virtex®
Package Tray
Number of LABs/CLBs 3456
Number of Logic Elements/Cells 15552
Total RAM Bits 98304
Number of I/O 444
Number of Gates 661111
Voltage - Supply 2.375V ~ 2.625V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 676-BGA
Supplier Device Package 676-FBGA (27x27)
Base Product Number XCV600

XCV600-5FG676C Datasheet Download


XCV600-5FG676C Overview



The XCV600-5FG676C is a high-performance, low-power, field-programmable gate array (FPGA) chip. It is manufactured by Xilinx, a leading provider of programmable logic solutions. This chip is designed for use in a wide range of applications, such as embedded systems, data processing, communications, and audio/video systems.


The XCV600-5FG676C chip has a total of 576,000 logic cells and a maximum operating frequency of up to 300 MHz. It also features a high-speed I/O system, with a total of 1,024 I/O pins. The chip is capable of supporting up to 32-bit data widths and is compatible with a variety of industry-standard protocols, such as PCI Express, USB, and Ethernet.


In terms of power consumption, the XCV600-5FG676C chip has a total power rating of 6.7 W, making it suitable for use in low-power applications. It also features a wide range of built-in security features, such as AES encryption, SHA-2 authentication, and secure boot.


The XCV600-5FG676C chip is designed for use in a wide range of applications, including industrial automation, automotive, consumer electronics, and medical devices. It is also suitable for use in applications that require high-speed data processing and low-power consumption. The chip is also compatible with a variety of development tools, such as the Xilinx Vivado Design Suite and the Xilinx Platform Studio.



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