AMD Xilinx
XCV600-5BGG560I
XCV600-5BGG560I ECAD Model
XCV600-5BGG560I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 661111 | |
| Number of CLBs | 3456 | |
| Combinatorial Delay of a CLB-Max | 700 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 3456 CLBS, 661111 GATES | |
| Clock Frequency-Max | 294 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LBGA, | |
| Pin Count | 560 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV600-5BGG560I Datasheet Download
XCV600-5BGG560I Overview
The XCV600-5BGG560I chip model is a powerful, reliable and versatile solution for many complex digital signal processing applications. It is designed to provide high-performance embedded processing, image processing, and other digital signal processing tasks, and is suitable for a wide range of applications.
The XCV600-5BGG560I chip model is based on an advanced VLSI architecture that is optimized for high-performance digital signal processing. It is designed to support multiple high-level HDL languages, such as Verilog, VHDL, and SystemVerilog, which makes it suitable for a wide range of applications. The XCV600-5BGG560I chip model is also designed to be flexible, allowing for future upgrades and modifications.
The XCV600-5BGG560I chip model is designed with specific design requirements in mind. It is capable of supporting high-speed communication systems and is suitable for applications that require high-performance digital signal processing. It is also designed to be energy-efficient, providing low power consumption and high performance. Additionally, the XCV600-5BGG560I chip model is designed to be reliable and durable, making it suitable for long-term operation.
The XCV600-5BGG560I chip model has been successfully applied in a variety of applications, including embedded systems, image processing, and communication systems. It has also been used in a number of case studies, which demonstrate its effectiveness in a variety of scenarios. Additionally, the XCV600-5BGG560I chip model is designed to be easy to use, with clear instructions and helpful documentation.
When using the XCV600-5BGG560I chip model, it is important to take into account the specific design requirements of the application. Additionally, it is important to ensure that the chip model is used correctly and in accordance with the manufacturer's instructions. This will ensure that the XCV600-5BGG560I chip model is used correctly and efficiently, providing the best performance and reliability.
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