AMD Xilinx
XCV600-5BGG560C
XCV600-5BGG560C ECAD Model
XCV600-5BGG560C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 661111 | |
| Number of CLBs | 3456 | |
| Combinatorial Delay of a CLB-Max | 700 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 3456 CLBS, 661111 GATES | |
| Clock Frequency-Max | 294 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LBGA, | |
| Pin Count | 560 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV600-5BGG560C Datasheet Download
XCV600-5BGG560C Overview
The chip model XCV600-5BGG560C is a powerful tool for the development and popularization of future intelligent robots and networks. It has become increasingly popular in the industry due to its ability to support new technologies and its potential applications in a variety of intelligent scenarios. As the demand for increased intelligence in networks and robots continues to grow, the XCV600-5BGG560C has become an indispensable part of the industry.
The XCV600-5BGG560C is a versatile chip model that can be used in a variety of applications. It is capable of supporting new technologies and can be used in a variety of intelligent scenarios. It can be used in the development of intelligent robots, as well as in the development of networks and other intelligent systems. It is also capable of being used in the era of fully intelligent systems, as it is capable of supporting the most advanced technologies.
In order to use the XCV600-5BGG560C effectively, a variety of technical talents are needed. These include engineers, computer scientists, and other professionals with knowledge of the latest technologies. These professionals must be able to understand the intricacies of the chip model and how it can be used to develop intelligent robots and networks. They must also be able to understand the implications of the chip model in the development of intelligent systems and how it can be used to create better networks and robots.
The XCV600-5BGG560C is a powerful tool for the development and popularization of future intelligent robots and networks. It is a versatile chip model that can be used in a variety of applications and is capable of supporting new technologies. It is a tool that is essential for the development of intelligent systems and can be used in the era of fully intelligent systems. With the help of the right professionals, the XCV600-5BGG560C can be used to create better networks and robots.
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1,511 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $811.4957 | $811.4957 |
| 10+ | $802.7699 | $8,027.6992 |
| 100+ | $759.1411 | $75,914.1120 |
| 1000+ | $715.5123 | $357,756.1600 |
| 10000+ | $654.4320 | $654,432.0000 |
| The price is for reference only, please refer to the actual quotation! | ||