AMD Xilinx
XCV600-4FGG676I
XCV600-4FGG676I ECAD Model
XCV600-4FGG676I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 661111 | |
| Number of CLBs | 3456 | |
| Combinatorial Delay of a CLB-Max | 800 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 3456 CLBS, 661111 GATES | |
| Clock Frequency-Max | 250 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B676 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 676 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 676 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV600-4FGG676I Datasheet Download
XCV600-4FGG676I Overview
The XCV600-4FGG676I chip model is a high-performance digital signal processor, embedded processor, and image processor that requires the use of HDL language. It is designed to provide a wide range of applications for a variety of industries, including automotive, industrial, and medical.
The chip model is designed to be used in a wide range of applications, from high-performance digital signal processing to embedded processing and image processing. It has the capability to process large amounts of data quickly and accurately, making it ideal for applications such as machine learning, artificial intelligence, and autonomous systems.
The chip model is also designed to be used in networks and can be used to support a variety of intelligent scenarios. This includes applications such as intelligent transportation systems, autonomous vehicles, and smart homes. It can also be used in the era of fully intelligent systems, such as the Internet of Things (IoT) and artificial intelligence (AI).
In terms of industry trends, the chip model is likely to continue to be used in a variety of applications. As technology advances, the chip model will likely be used in more and more applications. This is due to its ability to process large amounts of data quickly and accurately and its support for a variety of intelligent scenarios.
In terms of future development, the chip model is likely to continue to be used in more and more applications as technology advances. As new technologies emerge, the chip model may require the support of these new technologies. For example, as the Internet of Things (IoT) and artificial intelligence (AI) become more prevalent, the chip model may require the support of these technologies in order to be used in more intelligent scenarios.
Overall, the XCV600-4FGG676I chip model is a powerful and versatile processor that can be used in a variety of applications. It is designed for high-performance digital signal processing, embedded processing, and image processing and can be used in networks and intelligent scenarios. As technology advances, the chip model may require the support of new technologies in order to be used in more intelligent scenarios. It is likely to continue to be used in a variety of applications and is likely to be used in the era of fully intelligent systems.
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|---|---|---|
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