
AMD Xilinx
XCV600-4FG676I
XCV600-4FG676I ECAD Model
XCV600-4FG676I Attributes
Type | Description | Select |
---|---|---|
Mfr | AMD Xilinx | |
Series | Virtex® | |
Package | Tray | |
Number of LABs/CLBs | 3456 | |
Number of Logic Elements/Cells | 15552 | |
Total RAM Bits | 98304 | |
Number of I/O | 444 | |
Number of Gates | 661111 | |
Voltage - Supply | 2.375V ~ 2.625V | |
Mounting Type | Surface Mount | |
Operating Temperature | -40°C ~ 100°C (TJ) | |
Package / Case | 676-BGA | |
Supplier Device Package | 676-FBGA (27x27) | |
Base Product Number | XCV600 |
XCV600-4FG676I Datasheet Download
XCV600-4FG676I Overview
The XCV600-4FG676I is a high-performance, low-power Field Programmable Gate Array (FPGA) manufactured by Xilinx. It is a part of the Virtex-6 FPGA family and is based on the Virtex-6 LX760T FPGA architecture.
The device has a total of 676 I/O pins, with a total of 4 banks of I/O pins with different voltage levels. It has a maximum power consumption of 13.5 watts and a maximum operating temperature of 85°C. It is designed with a 0.13 micron process technology and is available in a 890-pin FineLine BGA package.
The XCV600-4FG676I is a high-performance FPGA, capable of operating at up to 400 MHz and has a total of 4.5 million system gates. It also includes a range of features such as high-speed transceivers, high-speed serial I/O, high-density memory, and a range of digital signal processing (DSP) capabilities.
The XCV600-4FG676I is suitable for a wide range of applications, including high-end networking, medical imaging, industrial automation, automotive, and aerospace systems. It is also suitable for applications requiring high-speed signal processing, data transfer, and high-density memory. The device can also be used in applications that require low-power, high-performance FPGA solutions.
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