XCV600-4FG676C
XCV600-4FG676C
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AMD Xilinx

XCV600-4FG676C


XCV600-4FG676C
F20-XCV600-4FG676C
Active
IC FPGA 444 I/O 676FCBGA
676-FBGA (27x27)

XCV600-4FG676C ECAD Model


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XCV600-4FG676C Attributes


Type Description Select
Mfr AMD Xilinx
Series Virtex®
Package Tray
Number of LABs/CLBs 3456
Number of Logic Elements/Cells 15552
Total RAM Bits 98304
Number of I/O 444
Number of Gates 661111
Voltage - Supply 2.375V ~ 2.625V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 676-BGA
Supplier Device Package 676-FBGA (27x27)
Base Product Number XCV600

XCV600-4FG676C Datasheet Download


XCV600-4FG676C Overview



The XCV600-4FG676C is a field-programmable gate array (FPGA) chip manufactured by Xilinx. It is a mid-range FPGA that features a rich set of features and performance capabilities. It comes with 4,672 logic cells, 676 I/O pins, and 4,096 bits of distributed RAM. The XCV600-4FG676C chip is designed for high-speed and high-performance applications, such as signal processing and embedded systems.


The XCV600-4FG676C chip provides a wide range of features, including high-speed signal processing, embedded system design, and a wide range of I/O options. It also supports a variety of development tools, such as the Xilinx Vivado Design Suite, for easy programming and development. The chip also supports a variety of programming languages, including Verilog and VHDL.


The XCV600-4FG676C chip is ideal for applications that require high-speed signal processing, embedded system design, and a wide range of I/O options. It is also suitable for applications that require low-power operation and high-performance. The chip is also suitable for a variety of industrial and consumer applications, such as automotive, medical, and consumer electronics.


In summary, the XCV600-4FG676C is a mid-range FPGA chip with a rich set of features and performance capabilities. It is designed for high-speed and high-performance applications, such as signal processing and embedded systems. It provides a wide range of features, including high-speed signal processing, embedded system design, and a wide range of I/O options. It is suitable for a variety of industrial and consumer applications, such as automotive, medical, and consumer electronics.



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