AMD Xilinx
XCV600-4BGG560I
XCV600-4BGG560I ECAD Model
XCV600-4BGG560I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 661111 | |
| Number of CLBs | 3456 | |
| Combinatorial Delay of a CLB-Max | 800 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 3456 CLBS, 661111 GATES | |
| Clock Frequency-Max | 250 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LBGA, | |
| Pin Count | 560 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV600-4BGG560I Datasheet Download
XCV600-4BGG560I Overview
The chip model XCV600-4BGG560I is a new model developed by a leading technology company in the semiconductor industry. It is designed to provide a comprehensive and reliable solution for a wide range of applications, including communication systems, networks, and intelligent scenarios.
The XCV600-4BGG560I provides a number of advantages over its competitors. It is designed to be low power, highly efficient, and cost-effective. It also offers a wide range of features, including high-speed data processing, low latency, and advanced security. Furthermore, it is designed to be compatible with a variety of communication protocols, making it suitable for use in a wide range of applications.
The XCV600-4BGG560I is expected to be in high demand in the near future. Its low power consumption and highly efficient design make it well-suited for use in the increasingly energy-conscious world. Additionally, its advanced features make it well-suited for use in communication systems, networks, and intelligent scenarios.
The XCV600-4BGG560I is also designed with the possibility of future upgrades in mind. It is designed to be compatible with a variety of communication protocols, making it suitable for use in a wide range of applications. Furthermore, it is designed to be compatible with various intelligent systems, making it suitable for use in the era of fully intelligent systems.
Overall, the XCV600-4BGG560I is a highly advanced chip model that offers a wide range of advantages over its competitors. Its low power consumption and highly efficient design make it well-suited for use in the increasingly energy-conscious world. Furthermore, its advanced features make it well-suited for use in communication systems, networks, and intelligent scenarios. Additionally, its compatibility with a variety of communication protocols and intelligent systems make it suitable for use in the era of fully intelligent systems. As such, the XCV600-4BGG560I is expected to be in high demand in the near future.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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