AMD Xilinx
XCV600-4BGG560C
XCV600-4BGG560C ECAD Model
XCV600-4BGG560C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 661111 | |
| Number of CLBs | 3456 | |
| Combinatorial Delay of a CLB-Max | 800 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 3456 CLBS, 661111 GATES | |
| Clock Frequency-Max | 250 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LBGA, | |
| Pin Count | 560 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV600-4BGG560C Datasheet Download
XCV600-4BGG560C Overview
The XCV600-4BGG560C chip model is a versatile tool for engineers and developers who require high-performance digital signal processing, embedded processing and image processing. It is designed to be used with the HDL (Hardware Description Language) language, making it a powerful and flexible solution for a variety of applications.
This chip model can be used in a wide range of scenarios, from simple communication networks to complex, intelligent systems. It can be used to develop and implement sophisticated applications, such as machine learning and artificial intelligence. For example, it could be used to create intelligent robots that can interact with their environment, process data, and make decisions.
The chip model is also suitable for the development and popularization of future intelligent robots. It is capable of processing large amounts of data quickly and accurately, allowing robots to make decisions and take actions in real-time. In order to use the chip model effectively, developers need to have a good understanding of HDL and be familiar with the design and implementation of complex systems.
Overall, the XCV600-4BGG560C chip model is a powerful tool for developers who are looking to create and implement sophisticated applications. It is suitable for a range of applications, from simple communication networks to complex, intelligent systems. With its ability to process large amounts of data quickly and accurately, it is a great tool for the development and popularization of future intelligent robots.
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1,186 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $223.2000 | $223.2000 |
| 10+ | $220.8000 | $2,208.0000 |
| 100+ | $208.8000 | $20,880.0000 |
| 1000+ | $196.8000 | $98,400.0000 |
| 10000+ | $180.0000 | $180,000.0000 |
| The price is for reference only, please refer to the actual quotation! | ||