AMD Xilinx
XCV600-4BGG432C
XCV600-4BGG432C ECAD Model
XCV600-4BGG432C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 661111 | |
| Number of CLBs | 3456 | |
| Combinatorial Delay of a CLB-Max | 800 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 3456 CLBS, 661111 GATES | |
| Clock Frequency-Max | 250 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B432 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 432 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LBGA, | |
| Pin Count | 432 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV600-4BGG432C Datasheet Download
XCV600-4BGG432C Overview
The chip model XCV600-4BGG432C is a powerful and efficient processor that has been gaining popularity in the industry due to its impressive performance. It is a high-performance and low-power processor with a multi-core architecture, making it suitable for a wide range of applications. The chip model is capable of handling complex tasks with ease, and it is also capable of running multiple applications simultaneously.
The future of the chip model XCV600-4BGG432C is bright, as it is expected to become even more popular in the industry. This is due to its ability to meet the needs of a variety of applications and the fact that it is highly efficient and cost-effective. In addition, the chip model is expected to be used in a variety of applications, including robotics, artificial intelligence, and machine learning.
In terms of the application environment, the chip model XCV600-4BGG432C is expected to be used in various areas, including industrial automation, medical applications, and consumer electronics. Furthermore, it is expected to be used in the development and popularization of future intelligent robots. To do so, the model requires the support of new technologies, such as machine learning and artificial intelligence.
In order to use the chip model XCV600-4BGG432C effectively, it is necessary to have the right technical talent. This includes engineers who understand the chip model, as well as those who are familiar with artificial intelligence and machine learning. In addition, developers need to have the necessary skills to develop applications that can take advantage of the chip model’s capabilities.
In conclusion, the chip model XCV600-4BGG432C is a powerful and efficient processor that is expected to be used in a variety of applications in the future. It is expected to be used in the development and popularization of future intelligent robots, and it requires the support of new technologies, such as artificial intelligence and machine learning. In order to use the model effectively, it is necessary to have the right technical talent, including engineers and developers who understand the chip model and its capabilities.
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