AMD Xilinx
XCV50E-8PQG240I
XCV50E-8PQG240I ECAD Model
XCV50E-8PQG240I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 158 | |
| Number of Outputs | 158 | |
| Number of Logic Cells | 1728 | |
| Number of Equivalent Gates | 20736 | |
| Number of CLBs | 384 | |
| Combinatorial Delay of a CLB-Max | 400 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 384 CLBS, 20736 GATES | |
| Clock Frequency-Max | 416 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PQFP-G240 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 240 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Equivalence Code | QFP240,1.3SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 32 mm | |
| Length | 32 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | FQFP, QFP240,1.3SQ,20 | |
| Pin Count | 240 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV50E-8PQG240I Datasheet Download
XCV50E-8PQG240I Overview
The XCV50E-8PQG240I chip model is a powerful processor designed for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, allowing users to take advantage of its features and capabilities.
The XCV50E-8PQG240I chip model is a great choice for applications that require high-performance, reliable processing. It is designed to be highly efficient, allowing it to perform complex calculations quickly and accurately. It is also designed to be energy-efficient, reducing power consumption and providing a longer lifespan for the chip.
The XCV50E-8PQG240I chip model is also designed to be flexible, allowing it to be used in a variety of applications and environments. It is capable of handling a wide range of tasks, from basic data processing to complex image processing. It is also designed to be compatible with a variety of hardware and software platforms, making it easy to integrate into existing systems.
The XCV50E-8PQG240I chip model is also designed to be future-proof, allowing it to be used in a variety of new technologies and applications. It is designed to be compatible with new technologies, such as artificial intelligence and machine learning, allowing it to be used in a variety of new applications. It is also designed to be compatible with existing hardware and software platforms, making it easy to integrate into existing systems.
The XCV50E-8PQG240I chip model is expected to have a high demand in the future, due to its high performance, energy efficiency, flexibility, and compatibility with new technologies. It is an ideal choice for applications that require high-performance, reliable processing, and compatibility with new technologies. The chip model is expected to be used in a variety of applications, from basic data processing to complex image processing. The demand for the chip model is expected to continue to grow in the future, as new technologies become more widely available and more applications require the use of the chip model.
You May Also Be Interested In
1,278 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||