AMD Xilinx
XCV50E-8PQG240C
XCV50E-8PQG240C ECAD Model
XCV50E-8PQG240C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 158 | |
| Number of Outputs | 158 | |
| Number of Logic Cells | 1728 | |
| Number of Equivalent Gates | 20736 | |
| Number of CLBs | 384 | |
| Combinatorial Delay of a CLB-Max | 400 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 384 CLBS, 20736 GATES | |
| Clock Frequency-Max | 416 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PQFP-G240 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 240 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Equivalence Code | QFP240,1.3SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 32 mm | |
| Length | 32 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, QFP-240 | |
| Pin Count | 240 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | EAR99 |
XCV50E-8PQG240C Datasheet Download
XCV50E-8PQG240C Overview
The XCV50E-8PQG240C chip model is a high-performance chip designed for digital signal processing, embedded processing, and image processing. It is capable of tackling complex tasks and requires the use of HDL language to program it. The chip has been designed to meet the needs of the modern industry and its performance is unparalleled.
The XCV50E-8PQG240C chip model is a part of the industry-wide trend of using high-performance chips to improve efficiency and reduce costs. The chip is designed to be used in a wide variety of applications and can be used in both consumer and industrial applications. It is also capable of handling large amounts of data, making it suitable for data-intensive tasks.
In terms of the product description and design requirements of the XCV50E-8PQG240C chip model, the chip is designed to be used in a variety of applications and is capable of handling large amounts of data. It is also designed to be energy efficient, with low power consumption. The chip is also designed to be compatible with a wide range of operating systems, making it easy to integrate into existing systems.
In terms of actual case studies and precautions, the XCV50E-8PQG240C chip model has been used in a variety of applications and has been proven to be reliable and efficient. It is important to note that the chip is designed to be used in specific applications and is not suitable for all applications. It is also important to note that the chip is designed to be used in specific operating systems and is not compatible with all operating systems.
In terms of future development and industry trends, the XCV50E-8PQG240C chip model is designed to be used in a wide variety of applications and is capable of handling large amounts of data. It is likely that the chip will be used in more applications in the future, as well as in more advanced applications. It is also likely that the chip will require the support of new technologies, such as artificial intelligence and machine learning, in order to increase its efficiency and performance.
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