AMD Xilinx
XCV50E-8CSG144C
XCV50E-8CSG144C ECAD Model
XCV50E-8CSG144C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 94 | |
| Number of Outputs | 94 | |
| Number of Logic Cells | 1728 | |
| Number of Equivalent Gates | 20736 | |
| Number of CLBs | 384 | |
| Combinatorial Delay of a CLB-Max | 400 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 384 CLBS, 20736 GATES | |
| Clock Frequency-Max | 416 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA144,13X13,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 800 µm | |
| Terminal Position | BOTTOM | |
| Width | 12 mm | |
| Length | 12 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | CSP-144 | |
| Pin Count | 144 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | EAR99 |
XCV50E-8CSG144C Datasheet Download
XCV50E-8CSG144C Overview
The XCV50E-8CSG144C chip model is a cutting-edge product developed by the global semiconductor industry leader, XYZ Technologies. It is a high-performance, low-power field-programmable gate array (FPGA) chip model, designed to meet the needs of the most demanding applications. With its integrated memory blocks, DSP blocks, and configurable logic blocks, the XCV50E-8CSG144C is capable of performing complex functions in a wide range of industries, from automotive to aerospace.
The XCV50E-8CSG144C chip model is a highly versatile chip model, and its features make it suitable for use in a variety of applications. Its low-power consumption, high-speed performance, and low-cost make it a great choice for embedded systems, industrial automation, and consumer electronics. Its programmability and flexibility also make it ideal for a wide range of applications, such as machine learning, image processing, and robotics.
The XCV50E-8CSG144C chip model has several advantages that make it an attractive choice for a variety of industries. It has a high level of integration, which allows it to perform complex tasks without taking up too much space on the board. It is also highly efficient, with its low power consumption and high-speed performance. The chip model also offers a wide range of features and functions, making it suitable for a variety of applications.
In addition, the XCV50E-8CSG144C chip model is expected to be in high demand in the coming years, as the demand for high-performance, low-power solutions continues to grow. It is likely to be used in a wide range of industries, from automotive to aerospace, as well as in consumer electronics, medical devices, and robotics.
When using the XCV50E-8CSG144C chip model, it is important to consider the specific design requirements of the application. For example, if the application requires high-speed data transfer, then the chip model must be designed to support this feature. It is also important to consider the power consumption of the chip model, as this will affect the performance of the application. Additionally, the chip model must be programmed correctly to ensure that it is compatible with the application.
The XCV50E-8CSG144C chip model can be used in the development and popularization of future intelligent robots. It is capable of performing complex tasks, such as pathfinding, object recognition, and navigation. Furthermore, its programmability and flexibility make it suitable for use in a wide range of applications, such as machine learning, image processing, and robotics. To use the XCV50E-8CSG144C chip model effectively, technical talents with knowledge of FPGA design and programming are necessary.
In conclusion, the XCV50E-8CSG144C chip model is a high-performance, low-power FPGA chip model that is suitable for use in a variety of industries. It has several advantages, such as low power consumption, high-speed performance, and low cost. It is expected to be in high demand in the coming years, and it can be used in the development and popularization of future intelligent robots. To use the XCV50E-8CSG144C chip model effectively, technical talents with knowledge of FPGA design and programming are necessary.
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