AMD Xilinx
XCV50E-8CS144I
XCV50E-8CS144I ECAD Model
XCV50E-8CS144I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 94 | |
| Number of Outputs | 94 | |
| Number of Logic Cells | 1728 | |
| Number of Equivalent Gates | 20736 | |
| Number of CLBs | 384 | |
| Combinatorial Delay of a CLB-Max | 400 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 384 CLBS, 20736 GATES | |
| Clock Frequency-Max | 416 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 240 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA144,13X13,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 800 µm | |
| Terminal Position | BOTTOM | |
| Width | 12 mm | |
| Length | 12 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | CSP-144 | |
| Pin Count | 144 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XCV50E-8CS144I Datasheet Download
XCV50E-8CS144I Overview
The XCV50E-8CS144I chip model is an advanced model designed for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with HDL language, which is a hardware description language used to create digital systems. It is an ideal choice for those who need a powerful and reliable chip.
The XCV50E-8CS144I chip model offers a number of advantages over other models. It is designed to be fast and reliable, with a wide range of features that make it suitable for a variety of applications. It is also designed to be energy-efficient, which makes it an economical choice. Additionally, the chip model is designed to be easy to use and program, with a streamlined design that makes it simple to integrate into existing systems.
The XCV50E-8CS144I chip model is expected to be in high demand in the future. This is due to its advanced features and its ability to handle complex tasks. It is also expected to be used in a variety of industries, from automotive to telecommunications. As more companies look to improve their systems, the demand for this chip model is only expected to increase.
The product description of the XCV50E-8CS144I chip model includes its power and performance, as well as its features and design. It is designed to be energy-efficient and reliable, and it is also designed to be easy to use and program. Additionally, it is designed to be compatible with a variety of HDL languages, making it easy to integrate into existing systems.
When designing a system with the XCV50E-8CS144I chip model, there are a few things to keep in mind. First, it is important to ensure that the system is designed to meet the chip's specifications, as this will ensure that it is able to handle the tasks it is meant to perform. Additionally, it is important to ensure that the system is designed so that it is able to take advantage of the chip's features and capabilities.
A number of case studies have been conducted to demonstrate the capabilities of the XCV50E-8CS144I chip model. In one case study, the chip was used to create a system for controlling a robotic arm. The system was able to successfully control the arm, and it was able to do so with a high degree of accuracy and reliability. This case study demonstrated the chip model's ability to handle complex tasks, as well as its energy-efficiency.
The XCV50E-8CS144I chip model is an advanced model designed for high-performance digital signal processing, embedded processing, and image processing. It is an ideal choice for those who need a powerful and reliable chip, and it is expected to be in high demand in the future. When designing a system with the chip model, it is important to ensure that it is designed to meet the chip's specifications, as this will ensure that it is able to handle the tasks it is meant to perform. Additionally, it is important to ensure that the system is designed so that it is able to take advantage of the chip's features and capabilities. A number of case studies have been conducted to demonstrate the capabilities of the chip model, and these have demonstrated its reliability and energy-efficiency.
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