AMD Xilinx
XCV50E-7PQG240C
XCV50E-7PQG240C ECAD Model
XCV50E-7PQG240C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 158 | |
| Number of Outputs | 158 | |
| Number of Logic Cells | 1728 | |
| Number of Equivalent Gates | 20736 | |
| Number of CLBs | 384 | |
| Combinatorial Delay of a CLB-Max | 420 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 384 CLBS, 20736 GATES | |
| Clock Frequency-Max | 400 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PQFP-G240 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 240 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Equivalence Code | QFP240,1.3SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 32 mm | |
| Length | 32 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, QFP-240 | |
| Pin Count | 240 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | EAR99 |
XCV50E-7PQG240C Datasheet Download
XCV50E-7PQG240C Overview
The XCV50E-7PQG240C chip model is a state-of-the-art device that is designed for high-performance digital signal processing, embedded processing, and image processing. It is a powerful device that is capable of performing complex tasks quickly and efficiently. The XCV50E-7PQG240C chip model is programmed using the HDL language, which allows for the design of powerful algorithms that can handle complex tasks.
The original design intention of the XCV50E-7PQG240C chip model was to provide a powerful and efficient platform for digital signal processing, embedded processing, and image processing. The device is designed to be upgradeable, allowing for future improvements to the hardware and software. This makes it possible to make the device more powerful and efficient over time.
The XCV50E-7PQG240C chip model has the potential to be used in advanced communication systems, such as in networks and wireless communication. It can be used to improve the speed and accuracy of communication systems, as well as to provide more secure connections. It is also possible for the chip model to be used in intelligent scenarios, such as in artificial intelligence and machine learning.
The XCV50E-7PQG240C chip model is capable of being used in the era of fully intelligent systems. It can be used to power devices that are capable of making decisions and performing complex tasks autonomously. This could be used in the development of autonomous vehicles, robotics, and even in the medical field. The chip model can be used to develop algorithms that are capable of making decisions and performing complex tasks in an efficient manner.
The XCV50E-7PQG240C chip model is a powerful device that can be used in a variety of applications. It is designed to be upgradeable, allowing for future improvements to the hardware and software. It can be used in advanced communication systems, intelligent scenarios, and even in the era of fully intelligent systems. The chip model is capable of performing complex tasks quickly and efficiently, making it a valuable tool for developers.
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