AMD Xilinx
XCV50E-7CSG144I
XCV50E-7CSG144I ECAD Model
XCV50E-7CSG144I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 94 | |
| Number of Outputs | 94 | |
| Number of Logic Cells | 1728 | |
| Number of Equivalent Gates | 20736 | |
| Number of CLBs | 384 | |
| Combinatorial Delay of a CLB-Max | 420 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 384 CLBS, 20736 GATES | |
| Clock Frequency-Max | 400 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA144,13X13,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 800 µm | |
| Terminal Position | BOTTOM | |
| Width | 12 mm | |
| Length | 12 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | CSP-144 | |
| Pin Count | 144 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | EAR99 |
XCV50E-7CSG144I Datasheet Download
XCV50E-7CSG144I Overview
The chip model XCV50E-7CSG144I is an advanced integrated circuit developed by a leading semiconductor company. It is designed for high-speed, low-power applications and is suitable for a wide range of applications in the communication, automotive, industrial, and consumer markets. The model is based on the latest technology, offering a high level of integration and performance.
The chip model XCV50E-7CSG144I is designed to meet the needs of the latest communication systems, providing high-speed data transfer and low power consumption in a highly integrated package. The model is based on an advanced silicon-on-insulator (SOI) process, which provides superior performance and reliability. The model also includes a high-speed serial port, allowing for easy connection to a wide range of devices.
The chip model XCV50E-7CSG144I is designed to be highly configurable and can be used in a wide variety of applications. It is also designed to be easily upgradable, allowing for future upgrades and enhancements. The model is also designed to be used in advanced communication systems, providing support for the latest technologies such as 4G LTE, 5G, and Wi-Fi.
The product description and specific design requirements of the chip model XCV50E-7CSG144I are detailed in the product datasheet. The datasheet includes the specifications of the model, including the power consumption, operating frequency, and performance. It also includes the features and capabilities of the model, as well as the actual case studies and precautions to be taken while using the model.
The chip model XCV50E-7CSG144I is an advanced integrated circuit that meets the needs of the latest communication systems. It is designed to be highly configurable and upgradable, providing support for the latest technologies. The product description and specific design requirements of the model are detailed in the product datasheet, along with actual case studies and precautions to be taken while using the model.
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5,554 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $86.4900 | $86.4900 |
| 10+ | $85.5600 | $855.6000 |
| 100+ | $80.9100 | $8,091.0000 |
| 1000+ | $76.2600 | $38,130.0000 |
| 10000+ | $69.7500 | $69,750.0000 |
| The price is for reference only, please refer to the actual quotation! | ||