AMD Xilinx
XCV50E-7CSG144C
XCV50E-7CSG144C ECAD Model
XCV50E-7CSG144C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 94 | |
| Number of Outputs | 94 | |
| Number of Logic Cells | 1728 | |
| Number of Equivalent Gates | 20736 | |
| Number of CLBs | 384 | |
| Combinatorial Delay of a CLB-Max | 420 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 384 CLBS, 20736 GATES | |
| Clock Frequency-Max | 400 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA144,13X13,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 800 µm | |
| Terminal Position | BOTTOM | |
| Width | 12 mm | |
| Length | 12 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | CSP-144 | |
| Pin Count | 144 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | EAR99 |
XCV50E-7CSG144C Datasheet Download
XCV50E-7CSG144C Overview
The chip model XCV50E-7CSG144C is a powerful and versatile tool for digital signal processing, embedded processing, and image processing. It is capable of performing complex tasks quickly and accurately, and it requires the use of HDL language. This chip model is suitable for a wide range of applications, including networks, intelligent scenarios, and the development of future intelligent robots.
In terms of networks, the XCV50E-7CSG144C chip model can be used to create communications protocols, data transfer systems, and wireless networks. It can also be used to process and store data collected from sensors and other devices. By utilizing its powerful performance and high speed, the chip model can help to create an efficient and secure network infrastructure.
In terms of intelligent scenarios, the XCV50E-7CSG144C chip model can be used to create intelligent systems. It can be used to process and analyze data, and it can also be used to develop algorithms for machine learning and artificial intelligence. The chip model can be used to create intelligent robots that can interact with their environment and make decisions based on the data they receive.
In terms of the development and popularization of future intelligent robots, the XCV50E-7CSG144C chip model can be used to create robots that are capable of performing complex tasks and making decisions based on their environment. The chip model can be used to create robots that can interact with humans and other robots, and it can also be used to create robots that can learn from their environment and adapt to changing conditions.
In order to use the XCV50E-7CSG144C chip model effectively, technical talents are needed to understand the chip model and its capabilities. Knowledge of HDL language and programming is essential, as well as knowledge of robotics, machine learning, and artificial intelligence. In addition, knowledge of hardware design and system engineering is also necessary in order to create efficient and reliable robotic systems.
The chip model XCV50E-7CSG144C is a powerful and versatile tool that can be used in a variety of applications. It is capable of performing complex tasks quickly and accurately, and it can be used to create networks, intelligent systems, and robots. With the right technical knowledge and skills, the XCV50E-7CSG144C chip model can be used to create powerful and reliable systems for the future.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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