AMD Xilinx
XCV50E-6PQG240I
XCV50E-6PQG240I ECAD Model
XCV50E-6PQG240I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 158 | |
| Number of Outputs | 158 | |
| Number of Logic Cells | 1728 | |
| Number of Equivalent Gates | 20736 | |
| Number of CLBs | 384 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 384 CLBS, 20736 GATES | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PQFP-G240 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 240 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Equivalence Code | QFP240,1.3SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 32 mm | |
| Length | 32 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, QFP-240 | |
| Pin Count | 240 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | EAR99 |
XCV50E-6PQG240I Datasheet Download
XCV50E-6PQG240I Overview
The chip model XCV50E-6PQG240I is a high-performance digital signal processor that is suitable for embedded processing, image processing, and other applications. It is designed to be used with the HDL (Hardware Description Language) to provide users with the highest performance possible.
The chip model XCV50E-6PQG240I is a great choice for those looking for a powerful and reliable processor for their digital signal processing needs. It has a wide range of features and capabilities, making it ideal for a variety of applications. It is also designed to be compatible with existing hardware, making it an ideal choice for those looking to upgrade their existing systems.
The industry trends of the chip model XCV50E-6PQG240I and the future development of related industries will depend on what specific technologies are needed. High-performance digital signal processing, embedded processing, and image processing are all becoming increasingly important in today's world. As such, it is important to consider the latest technological advancements when considering a processor for these applications.
In terms of product description and specific design requirements, the chip model XCV50E-6PQG240I is designed to be used with the HDL language and offers a wide range of features and capabilities. It is designed to be highly efficient and powerful, making it a great choice for those looking for the best performance possible. Additionally, it is designed to be compatible with existing hardware, making it an ideal choice for those looking to upgrade their existing systems.
When considering the chip model XCV50E-6PQG240I, it is important to look at actual case studies and take into account any potential issues and precautions that may arise. This will help to ensure that the chip model is the right choice for the specific application and environment. Additionally, it is important to consider any new technologies that may be needed to support the application environment.
Overall, the chip model XCV50E-6PQG240I is a great choice for those looking for a powerful and reliable processor for their digital signal processing needs. It is designed to be used with the HDL language and offers a wide range of features and capabilities. Additionally, it is designed to be compatible with existing hardware, making it an ideal choice for those looking to upgrade their existing systems. Finally, it is important to consider any potential issues and precautions that may arise, as well as any new technologies that may be needed to support the application environment.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||