AMD Xilinx
XCV50E-6PQG240C
XCV50E-6PQG240C ECAD Model
XCV50E-6PQG240C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 158 | |
| Number of Outputs | 158 | |
| Number of Logic Cells | 1728 | |
| Number of Equivalent Gates | 20736 | |
| Number of CLBs | 384 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 384 CLBS, 20736 GATES | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PQFP-G240 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 240 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Equivalence Code | QFP240,1.3SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 32 mm | |
| Length | 32 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, QFP-240 | |
| Pin Count | 240 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XCV50E-6PQG240C Datasheet Download
XCV50E-6PQG240C Overview
The XCV50E-6PQG240C chip model is a powerful and versatile semiconductor device that is suitable for a variety of applications. It is primarily used for high-performance digital signal processing, embedded processing, and image processing. To make the most of it, the user must be proficient in the use of HDL language.
The chip model is becoming increasingly popular in the industry, and its future development will be determined by the specific technologies that are needed. As technology advances, the chip model may be applied to the development and popularization of future intelligent robots. To do so, the user must have a good understanding of the chip model and must possess the necessary technical talents to use it effectively.
The chip model is a powerful tool that can be used to create complex systems and applications. It is important for the user to understand the full capabilities of the chip model and to be able to use it in the most effective way. This requires the user to have a good grasp of the HDL language and the underlying technologies. Moreover, the user must be able to stay up to date with the latest advancements in the industry to ensure the chip model is used in the most efficient and effective manner.
In conclusion, the XCV50E-6PQG240C chip model is a powerful and versatile semiconductor device that is suitable for a variety of applications. It is becoming increasingly popular in the industry and may be applied to the development and popularization of future intelligent robots. To make the most of it, the user must have a good understanding of the chip model and must possess the necessary technical talents to use it effectively.
You May Also Be Interested In
5,853 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||