
AMD Xilinx
XCV50E-6CSG144I
XCV50E-6CSG144I ECAD Model
XCV50E-6CSG144I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.8 V | |
Number of Inputs | 94 | |
Number of Outputs | 94 | |
Number of Logic Cells | 1728 | |
Number of Equivalent Gates | 20736 | |
Number of CLBs | 384 | |
Combinatorial Delay of a CLB-Max | 470 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 384 CLBS, 20736 GATES | |
Clock Frequency-Max | 357 MHz | |
Power Supplies | 1.2/3.6,1.8 V | |
Supply Voltage-Max | 1.89 V | |
Supply Voltage-Min | 1.71 V | |
JESD-30 Code | S-PBGA-B144 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Peak Reflow Temperature (Cel) | 260 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 144 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFBGA | |
Package Equivalence Code | BGA144,13X13,32 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 800 µm | |
Terminal Position | BOTTOM | |
Width | 12 mm | |
Length | 12 mm | |
Seated Height-Max | 1.2 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | CSP-144 | |
Pin Count | 144 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 | |
ECCN Code | EAR99 |
XCV50E-6CSG144I Datasheet Download
XCV50E-6CSG144I Overview
The XCV50E-6CSG144I is a chip model that offers a wide range of advantages over traditional chip models. It is the latest iteration of the Xilinx Virtex family of FPGAs, and it has been designed to provide the highest levels of performance, flexibility, and scalability for a variety of applications. This chip model is ideal for use in networks, as well as for intelligent scenarios such as machine learning, artificial intelligence, and robotics.
The XCV50E-6CSG144I offers a number of advantages over other chip models. It is designed to be more power-efficient, with a lower power consumption than other chips. It also has a higher clock speed, which allows for faster data processing. Additionally, the chip model is designed for scalability and flexibility, allowing it to be used for a variety of applications.
The XCV50E-6CSG144I is expected to be in high demand in the near future, as the demand for intelligent systems and networks continues to grow. This chip model is well-suited for use in these types of applications, as it can handle the large data sets and complex algorithms that are required. Additionally, the scalability and flexibility of the chip model make it ideal for use in a variety of different scenarios.
The XCV50E-6CSG144I has a number of specific design requirements that must be met in order to ensure optimal performance. The chip model features a 32-bit RISC processor, a dual-channel memory controller, and a high-speed serial transceiver. Additionally, the chip model is designed to be programmable, allowing for customization to meet the needs of specific applications.
In order to ensure optimal performance, it is important to consider a number of factors when designing with the XCV50E-6CSG144I. These factors include the type of application, the size of the data set, and the complexity of the algorithms that will be used. Additionally, it is important to consider the power requirements of the chip model, as well as the environment in which it will be used.
The XCV50E-6CSG144I has been used in a number of case studies and applications. One example is in the development of a high-speed data acquisition system, which was able to achieve a data rate of 1 Gbps. Additionally, the chip model has been used in the development of a high-speed image processing system, which was able to achieve a processing speed of 1.2 Gbps.
In conclusion, the XCV50E-6CSG144I is a powerful chip model that offers a wide range of advantages over other chip models. It is designed to be more power-efficient, with a higher clock speed and scalability and flexibility for a variety of applications. Additionally, it is expected to be in high demand in the near future, as the demand for intelligent systems and networks continues to grow. Finally, it is important to consider a number of factors when designing with the XCV50E-6CSG144I, as well as to consider actual case studies and precautions.
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