AMD Xilinx
XCV50E-6CSG144C
XCV50E-6CSG144C ECAD Model
XCV50E-6CSG144C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 94 | |
| Number of Outputs | 94 | |
| Number of Logic Cells | 1728 | |
| Number of Equivalent Gates | 20736 | |
| Number of CLBs | 384 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 384 CLBS, 20736 GATES | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA144,13X13,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 800 µm | |
| Terminal Position | BOTTOM | |
| Width | 12 mm | |
| Length | 12 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | CSP-144 | |
| Pin Count | 144 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XCV50E-6CSG144C Datasheet Download
XCV50E-6CSG144C Overview
The chip model XCV50E-6CSG144C is a cutting-edge semiconductor device that has been developed for a wide range of applications. It offers a wide range of features and benefits, including improved performance and scalability, low power consumption, and robust security. With its advanced features, the chip model XCV50E-6CSG144C is expected to be widely adopted in the near future.
The chip model XCV50E-6CSG144C is designed to meet the demands of the latest trends in the industry. It is capable of supporting the latest technologies, such as 5G, artificial intelligence (AI), and the Internet of Things (IoT). It is also designed to be compatible with a wide range of operating systems and platforms, making it a great choice for businesses looking to leverage the latest technologies.
The chip model XCV50E-6CSG144C is expected to be used in a wide range of applications, including network infrastructure, storage systems, and embedded systems. It is also expected to be used in the era of fully intelligent systems, such as autonomous vehicles, smart homes, and smart cities. The chip model XCV50E-6CSG144C is expected to be used in a wide range of intelligent scenarios, such as facial recognition, natural language processing, and image processing.
In conclusion, the chip model XCV50E-6CSG144C is a cutting-edge semiconductor device that is expected to be widely adopted in the near future. It is designed to meet the demands of the latest trends in the industry and is capable of supporting the latest technologies. It is expected to be used in a wide range of applications and intelligent scenarios, making it a great choice for businesses looking to leverage the latest technologies.
You May Also Be Interested In
1,874 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $29.5725 | $29.5725 |
| 10+ | $29.2545 | $292.5453 |
| 100+ | $27.6646 | $2,766.4608 |
| 1000+ | $26.0747 | $13,037.3440 |
| 10000+ | $23.8488 | $23,848.8000 |
| The price is for reference only, please refer to the actual quotation! | ||