
AMD Xilinx
XCV50-6TQG144I
XCV50-6TQG144I ECAD Model
XCV50-6TQG144I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 2.5 V | |
Number of Equivalent Gates | 57906 | |
Number of CLBs | 384 | |
Combinatorial Delay of a CLB-Max | 600 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 384 CLBS, 57906 GATES | |
Clock Frequency-Max | 333 MHz | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
JESD-30 Code | S-PQFP-G144 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e3 | |
Moisture Sensitivity Level | 3 | |
Peak Reflow Temperature (Cel) | 260 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 144 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFQFP | |
Package Shape | SQUARE | |
Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
Surface Mount | YES | |
Terminal Finish | MATTE TIN | |
Terminal Form | GULL WING | |
Terminal Pitch | 500 µm | |
Terminal Position | QUAD | |
Width | 20 mm | |
Length | 20 mm | |
Seated Height-Max | 1.6 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | QFP | |
Package Description | LFQFP, | |
Pin Count | 144 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XCV50-6TQG144I Datasheet Download
XCV50-6TQG144I Overview
The XCV50-6TQG144I chip model is a cutting-edge integrated circuit which has been developed to meet a wide range of modern communication system requirements. It is designed to provide high-speed data processing, low-power consumption, and reliable operation in a wide range of applications. The XCV50-6TQG144I chip model has been designed to provide a flexible and cost-effective solution for a range of applications, from high-end telecom systems to low-end consumer electronics.
The original design intention of the XCV50-6TQG144I chip model was to provide a reliable and cost-effective solution for modern communication systems. The chip is designed to offer high-speed data processing, low-power consumption, and reliable operation in a wide range of applications. It is capable of handling a wide range of data rates, from low-speed consumer electronics to high-end telecom systems. The chip also provides a range of features that allow for future upgrades and expansion, including the ability to support multiple protocols, multiple frequency bands, and multiple data rates.
In terms of actual case studies, the XCV50-6TQG144I chip model has been used in a variety of applications, including high-speed wireless networks, digital television, and mobile phones. In each case, the chip has been able to provide reliable and cost-effective solutions for the application. In addition, the chip has been used in a range of industrial and consumer electronics applications, providing reliable and cost-effective solutions for those applications as well.
When considering the possibility of future upgrades and expansion of the XCV50-6TQG144I chip model, it is important to note that the chip is designed to be highly scalable, allowing for future upgrades and expansion without the need for any major redesigns. This scalability also allows for the chip to be used in applications that require higher data rates, such as advanced communication systems.
The XCV50-6TQG144I chip model can also be used in the development and popularization of future intelligent robots. The chip is designed to provide a reliable and cost-effective solution for a range of applications, from high-end telecom systems to low-end consumer electronics. The chip is also capable of handling a wide range of data rates, from low-speed consumer electronics to high-end telecom systems. In order to use the chip effectively in the development and popularization of future intelligent robots, it is important to have a team of experienced technical professionals who are familiar with the chip’s design and capabilities.
In conclusion, the XCV50-6TQG144I chip model is a cutting-edge integrated circuit which has been designed to meet a wide range of modern communication system requirements. The chip is designed to offer high-speed data processing, low-power consumption, and reliable operation in a wide range of applications. The chip is also highly scalable, allowing for future upgrades and expansion without the need for any major redesigns. Furthermore, the chip can be used in the development and popularization of future intelligent robots, provided a team of experienced technical professionals is employed to use the model effectively.
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