XCV50-6FGG256I
XCV50-6FGG256I
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rohs

AMD Xilinx

XCV50-6FGG256I


XCV50-6FGG256I
F20-XCV50-6FGG256I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, BGA
BGA

XCV50-6FGG256I ECAD Model


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XCV50-6FGG256I Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 2.5 V
Number of Equivalent Gates 57906
Number of CLBs 384
Combinatorial Delay of a CLB-Max 600 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Organization 384 CLBS, 57906 GATES
Clock Frequency-Max 333 MHz
Supply Voltage-Max 2.625 V
Supply Voltage-Min 2.375 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 17 mm
Length 17 mm
Seated Height-Max 2 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description BGA,
Pin Count 256
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XCV50-6FGG256I Datasheet Download


XCV50-6FGG256I Overview



The XCV50-6FGG256I chip model is a high-performance chip model developed by a leading company in the semiconductor industry. It is a 6-layer FPGA with a capacity of 256K gates, making it an ideal choice for a variety of applications. It is designed with the latest technology and is designed to be highly reliable and efficient.


The XCV50-6FGG256I chip model has several advantages over other models. It is a low-cost, high-performance chip model that can be used in a variety of applications. It is also highly reliable and efficient, making it suitable for use in a variety of industrial and commercial applications. Additionally, it is designed to be compatible with a variety of software and hardware platforms, making it easy to integrate into existing systems.


The XCV50-6FGG256I chip model is expected to experience increased demand in the coming years as the world moves towards a more connected and intelligent future. It is likely to be used in a variety of network applications, such as in the Internet of Things (IoT), smart homes, and other connected devices. Additionally, it could be used in a variety of intelligent scenarios, such as autonomous vehicles and smart factories.


The XCV50-6FGG256I chip model is also likely to be used in the development and popularization of future intelligent robots. This chip model is designed to be compatible with a variety of software and hardware platforms, making it easy to integrate into existing robotic systems. Additionally, it is highly reliable and efficient, making it suitable for use in a variety of robotic applications.


In order to effectively use the XCV50-6FGG256I chip model, a variety of technical talents are needed. These include software engineers, hardware engineers, and robotics engineers. Software engineers are needed to develop and maintain the software that runs on the chip model, while hardware engineers are needed to design and maintain the hardware components of the chip model. Robotics engineers are needed to develop and maintain the robotic systems that use the chip model.


The XCV50-6FGG256I chip model is a high-performance chip model that is expected to experience increased demand in the coming years. It is likely to be used in a variety of network applications, intelligent scenarios, and robotic systems. In order to effectively use the chip model, a variety of technical talents are needed, including software engineers, hardware engineers, and robotics engineers.



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QTY Unit Price Ext Price
1+ $71.4954 $71.4954
10+ $70.7267 $707.2666
100+ $66.8828 $6,688.2816
1000+ $63.0390 $31,519.4880
10000+ $57.6576 $57,657.6000
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