
AMD Xilinx
XCV50-6FGG256I
XCV50-6FGG256I ECAD Model
XCV50-6FGG256I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 2.5 V | |
Number of Equivalent Gates | 57906 | |
Number of CLBs | 384 | |
Combinatorial Delay of a CLB-Max | 600 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 384 CLBS, 57906 GATES | |
Clock Frequency-Max | 333 MHz | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
JESD-30 Code | S-PBGA-B256 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 256 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 17 mm | |
Length | 17 mm | |
Seated Height-Max | 2 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA, | |
Pin Count | 256 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XCV50-6FGG256I Datasheet Download
XCV50-6FGG256I Overview
The XCV50-6FGG256I chip model is a high-performance chip model developed by a leading company in the semiconductor industry. It is a 6-layer FPGA with a capacity of 256K gates, making it an ideal choice for a variety of applications. It is designed with the latest technology and is designed to be highly reliable and efficient.
The XCV50-6FGG256I chip model has several advantages over other models. It is a low-cost, high-performance chip model that can be used in a variety of applications. It is also highly reliable and efficient, making it suitable for use in a variety of industrial and commercial applications. Additionally, it is designed to be compatible with a variety of software and hardware platforms, making it easy to integrate into existing systems.
The XCV50-6FGG256I chip model is expected to experience increased demand in the coming years as the world moves towards a more connected and intelligent future. It is likely to be used in a variety of network applications, such as in the Internet of Things (IoT), smart homes, and other connected devices. Additionally, it could be used in a variety of intelligent scenarios, such as autonomous vehicles and smart factories.
The XCV50-6FGG256I chip model is also likely to be used in the development and popularization of future intelligent robots. This chip model is designed to be compatible with a variety of software and hardware platforms, making it easy to integrate into existing robotic systems. Additionally, it is highly reliable and efficient, making it suitable for use in a variety of robotic applications.
In order to effectively use the XCV50-6FGG256I chip model, a variety of technical talents are needed. These include software engineers, hardware engineers, and robotics engineers. Software engineers are needed to develop and maintain the software that runs on the chip model, while hardware engineers are needed to design and maintain the hardware components of the chip model. Robotics engineers are needed to develop and maintain the robotic systems that use the chip model.
The XCV50-6FGG256I chip model is a high-performance chip model that is expected to experience increased demand in the coming years. It is likely to be used in a variety of network applications, intelligent scenarios, and robotic systems. In order to effectively use the chip model, a variety of technical talents are needed, including software engineers, hardware engineers, and robotics engineers.
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1,138 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $71.4954 | $71.4954 |
10+ | $70.7267 | $707.2666 |
100+ | $66.8828 | $6,688.2816 |
1000+ | $63.0390 | $31,519.4880 |
10000+ | $57.6576 | $57,657.6000 |
The price is for reference only, please refer to the actual quotation! |