AMD Xilinx
XCV50-6FGG256C
XCV50-6FGG256C ECAD Model
XCV50-6FGG256C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 57906 | |
| Number of CLBs | 384 | |
| Combinatorial Delay of a CLB-Max | 600 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 384 CLBS, 57906 GATES | |
| Clock Frequency-Max | 333 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 256 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV50-6FGG256C Datasheet Download
XCV50-6FGG256C Overview
The XCV50-6FGG256C chip model is a powerful and versatile processor designed for high-performance digital signal processing, embedded processing, and image processing. The model is equipped with a range of features that make it the perfect choice for a variety of applications. It is also capable of using HDL language, making it suitable for complex tasks and applications.
The XCV50-6FGG256C chip model is in line with the industry trends of the current market. It is designed to meet the needs of high-performance digital signal processing, embedded processing, and image processing. The model is also capable of using HDL language, making it suitable for complex tasks and applications. As the industry continues to evolve, the XCV50-6FGG256C chip model will continue to remain relevant and in demand.
The XCV50-6FGG256C chip model has several advantages, including its ability to process data quickly and efficiently, its ability to use HDL language, and its ability to handle complex tasks. The model is also designed for scalability, meaning that it can be upgraded to accommodate new technologies and applications. This makes it a great choice for those who need to stay ahead of the curve.
The demand for the XCV50-6FGG256C chip model is expected to increase in the future as the industry continues to evolve. This is due to its versatility and scalability, as well as its ability to handle complex tasks and applications. As the industry continues to grow, the XCV50-6FGG256C chip model will continue to be sought after by those who need a powerful and reliable processor.
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1,189 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $71.4954 | $71.4954 |
| 10+ | $70.7267 | $707.2666 |
| 100+ | $66.8828 | $6,688.2816 |
| 1000+ | $63.0390 | $31,519.4880 |
| 10000+ | $57.6576 | $57,657.6000 |
| The price is for reference only, please refer to the actual quotation! | ||