
AMD Xilinx
XCV50-6CSG144I
XCV50-6CSG144I ECAD Model
XCV50-6CSG144I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 2.5 V | |
Number of Equivalent Gates | 57906 | |
Number of CLBs | 384 | |
Combinatorial Delay of a CLB-Max | 600 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 384 CLBS, 57906 GATES | |
Clock Frequency-Max | 333 MHz | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
JESD-30 Code | S-PBGA-B144 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Peak Reflow Temperature (Cel) | 260 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 144 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFBGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
Surface Mount | YES | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 800 µm | |
Terminal Position | BOTTOM | |
Width | 12 mm | |
Length | 12 mm | |
Seated Height-Max | 1.2 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | TFBGA, | |
Pin Count | 144 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XCV50-6CSG144I Datasheet Download
XCV50-6CSG144I Overview
The XCV50-6CSG144I chip model is a powerful tool for both current and future technology. Developed by Xilinx, this model is a Field Programmable Gate Array (FPGA) that is designed to provide the highest levels of performance, flexibility, and scalability. It provides a wide range of features, including a high-speed, low-power, and low-cost design, as well as the ability to support multiple protocols.
The XCV50-6CSG144I model provides numerous advantages to its users, including improved system performance and lower power consumption. It is capable of handling complex tasks and can be used in a variety of applications, such as data acquisition, signal processing, control systems, and communication networks. Furthermore, its scalability allows for easy upgrades in the future, making it ideal for any application.
In terms of expected demand trends, the XCV50-6CSG144I model is expected to become increasingly popular in the coming years. This is due to its ability to provide highly efficient solutions to a wide range of applications. As more industries require the use of advanced technologies, the demand for this model is likely to increase. Furthermore, its scalability and flexibility make it suitable for numerous applications, making it an attractive option for many industries.
The XCV50-6CSG144I model can also be applied to the development and popularization of future intelligent robots. This is due to its ability to process complex tasks and its scalability, which allows for easy upgrades in the future. Furthermore, its low power consumption and cost-effectiveness make it an attractive option for robot development. To use the model effectively, however, it is important to have a team of experienced technical professionals who are familiar with the model and its features.
In conclusion, the XCV50-6CSG144I chip model is a powerful tool for both current and future technology. Its numerous advantages, such as improved system performance and low power consumption, make it an attractive option for a variety of applications. Furthermore, its scalability and flexibility make it suitable for numerous industries, as well as the development and popularization of future intelligent robots. To use the model effectively, however, it is important to have a team of experienced technical professionals who are familiar with the model and its features.
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