AMD Xilinx
XCV50-6CSG144C
XCV50-6CSG144C ECAD Model
XCV50-6CSG144C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 57906 | |
| Number of CLBs | 384 | |
| Combinatorial Delay of a CLB-Max | 600 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 384 CLBS, 57906 GATES | |
| Clock Frequency-Max | 333 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 800 µm | |
| Terminal Position | BOTTOM | |
| Width | 12 mm | |
| Length | 12 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | TFBGA, | |
| Pin Count | 144 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV50-6CSG144C Datasheet Download
XCV50-6CSG144C Overview
The XCV50-6CSG144C chip model is a powerful and versatile model designed for communication systems. It is designed to provide reliable and secure wireless communication for a wide variety of applications. This model is capable of supporting multiple protocols, including Wi-Fi, Bluetooth, and Zigbee. It is also capable of supporting advanced communication systems, such as those used in military and aerospace applications.
The original design intention of the XCV50-6CSG144C chip model was to provide a reliable and secure platform for communication systems. It was designed to be robust and reliable, and to provide features such as encryption and authentication. This chip model is also designed to be upgradable, allowing for future improvements and upgrades. This makes it ideal for applications that require frequent updates and changes.
The product description and specific design requirements of the XCV50-6CSG144C chip model are detailed in the product manual. It includes information on the different components of the model, the design requirements, and the various features and functions. It also includes information on the various protocols supported by the model, as well as detailed instructions for installation and use.
The XCV50-6CSG144C chip model can also be applied to the development and popularization of future intelligent robots. It can be used to provide a reliable and secure platform for communication between robots and other devices. It can also be used to provide a secure platform for the transfer of data between robots and other devices. To use the model effectively, technical professionals with knowledge of the various protocols and features of the model are needed.
In conclusion, the XCV50-6CSG144C chip model is a powerful and versatile model designed for communication systems. It is designed to provide reliable and secure wireless communication for a wide variety of applications. It is designed to be upgradable, allowing for future improvements and upgrades. It can also be used for the development and popularization of future intelligent robots. Technical professionals with knowledge of the various protocols and features of the model are needed to use the model effectively.
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