AMD Xilinx
XCV50-6CS144I
XCV50-6CS144I ECAD Model
XCV50-6CS144I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 94 | |
| Number of Outputs | 94 | |
| Number of Logic Cells | 1728 | |
| Number of Equivalent Gates | 57906 | |
| Number of CLBs | 384 | |
| Combinatorial Delay of a CLB-Max | 600 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 384 CLBS, 57906 GATES | |
| Clock Frequency-Max | 333 MHz | |
| Power Supplies | 1.2/3.6,2.5 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA144,13X13,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 800 µm | |
| Terminal Position | BOTTOM | |
| Width | 12 mm | |
| Length | 12 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | CSP-144 | |
| Pin Count | 144 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XCV50-6CS144I Datasheet Download
XCV50-6CS144I Overview
The chip model XCV50-6CS144I is a powerful and versatile digital signal processor that is suitable for a wide range of applications. Its high performance and embedded processing capabilities make it an ideal choice for many digital signal processing and image processing tasks. This chip model is also notable for its requirement for the use of HDL language, which allows for more efficient and reliable code development and debugging.
The industry trends for the chip model XCV50-6CS144I are largely dependent on what specific technologies are needed in the application environment. For example, if new technologies such as machine learning or artificial intelligence are needed, then the chip model may need to be updated to support these technologies. Similarly, if new algorithms or protocols are needed, then the chip model may need to be updated to support these.
The chip model XCV50-6CS144I has several advantages that make it an attractive choice for many applications. Firstly, its use of HDL language ensures that code is developed and debugged efficiently and reliably, which is important for any digital signal processing or image processing task. Secondly, its high performance and embedded processing capabilities make it suitable for many demanding tasks. Finally, its versatility makes it suitable for a wide range of applications.
The future demand for the chip model XCV50-6CS144I is expected to remain strong in related industries. As new technologies such as machine learning, artificial intelligence, and new algorithms and protocols become more important in the application environment, the chip model will need to be updated to support them. In addition, as digital signal processing and image processing tasks become more complex and demanding, the chip model's high performance and embedded processing capabilities will become increasingly important. As such, the demand for the chip model XCV50-6CS144I is expected to remain strong in the future.
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