
AMD Xilinx
XCV50-6BGG256I
XCV50-6BGG256I ECAD Model
XCV50-6BGG256I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 2.5 V | |
Number of Equivalent Gates | 57906 | |
Number of CLBs | 384 | |
Combinatorial Delay of a CLB-Max | 600 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 384 CLBS, 57906 GATES | |
Clock Frequency-Max | 333 MHz | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
JESD-30 Code | S-PBGA-B256 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Peak Reflow Temperature (Cel) | 250 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 256 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 27 mm | |
Length | 27 mm | |
Seated Height-Max | 2.55 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA, | |
Pin Count | 256 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XCV50-6BGG256I Datasheet Download
XCV50-6BGG256I Overview
The XCV50-6BGG256I chip model is a powerful and versatile processor that is suitable for a variety of applications, including high-performance digital signal processing, embedded processing, and image processing. It is designed to be programmed using the HDL language, which is a high-level language designed for hardware description and simulation.
The XCV50-6BGG256I chip model offers a number of advantages over other models. It has a high clock speed and a large number of on-chip resources, making it well-suited for applications that require high performance. It also has a low power consumption, making it suitable for applications that require low energy consumption. Additionally, the chip model is highly customizable, allowing users to tailor it to their specific needs.
The demand for the XCV50-6BGG256I chip model is expected to increase in the future, as more applications require its capabilities. The chip model is well-suited for use in networks, as it is capable of processing large amounts of data quickly and efficiently. Additionally, the chip model is expected to be used in intelligent scenarios, as its high performance and low power consumption make it an ideal choice for machine learning and artificial intelligence applications.
Finally, the XCV50-6BGG256I chip model is expected to be used in the era of fully intelligent systems. Its high performance and low power consumption make it an ideal choice for powering autonomous systems, such as self-driving cars and robots. Additionally, its highly customizable nature makes it well-suited for use in applications that require specific hardware configurations. With its powerful capabilities and versatile design, the XCV50-6BGG256I chip model is expected to be an important part of the future of intelligent systems.
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2,843 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $99.1603 | $99.1603 |
10+ | $98.0941 | $980.9408 |
100+ | $92.7629 | $9,276.2880 |
1000+ | $87.4317 | $43,715.8400 |
10000+ | $79.9680 | $79,968.0000 |
The price is for reference only, please refer to the actual quotation! |