
AMD Xilinx
XCV50-6BGG256C
XCV50-6BGG256C ECAD Model
XCV50-6BGG256C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 2.5 V | |
Number of Equivalent Gates | 57906 | |
Number of CLBs | 384 | |
Combinatorial Delay of a CLB-Max | 600 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 384 CLBS, 57906 GATES | |
Clock Frequency-Max | 333 MHz | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
JESD-30 Code | S-PBGA-B256 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 250 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 256 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 27 mm | |
Length | 27 mm | |
Seated Height-Max | 2.55 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA, | |
Pin Count | 256 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XCV50-6BGG256C Datasheet Download
XCV50-6BGG256C Overview
The XCV50-6BGG256C chip model is a powerful tool for high performance digital signal processing, embedded processing, and image processing. It is a field-programmable gate array (FPGA) that uses Hardware Description Language (HDL) to create digital logic circuits. It is designed for use in a wide range of applications, from simple logic circuits to complex systems.
The XCV50-6BGG256C chip model has several advantages over other FPGA models. It has a larger capacity of 256 CLBs, which allows for more complex logic designs. It also has a higher clock speed of up to 600MHz, allowing for faster processing. Additionally, the chip model is designed to be highly customizable, with a range of options for configuring the logic design.
The demand for the XCV50-6BGG256C chip model is expected to increase in the coming years. This is due to the increasing need for high-performance digital signal processing, embedded processing, and image processing in various industries. The chip model is also becoming more popular in the development of artificial intelligence (AI) and robotics.
The XCV50-6BGG256C chip model can be used in the development and popularization of future intelligent robots. It is capable of handling complex image processing and machine learning tasks, which are essential for the development of intelligent robots. To use the chip model effectively, technical talents with knowledge and experience in HDL language, AI, and robotics are required.
In conclusion, the XCV50-6BGG256C chip model is a powerful tool for high-performance digital signal processing, embedded processing, and image processing. It has several advantages over other FPGA models and is expected to be in high demand in the coming years. It can also be used for the development and popularization of future intelligent robots, although technical talents with knowledge and experience in HDL language, AI, and robotics are required to use it effectively.
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2,275 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $99.1603 | $99.1603 |
10+ | $98.0941 | $980.9408 |
100+ | $92.7629 | $9,276.2880 |
1000+ | $87.4317 | $43,715.8400 |
10000+ | $79.9680 | $79,968.0000 |
The price is for reference only, please refer to the actual quotation! |