XCV50-6BGG256C
XCV50-6BGG256C
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XCV50-6BGG256C


XCV50-6BGG256C
F20-XCV50-6BGG256C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, BGA
BGA

XCV50-6BGG256C ECAD Model


Download the free Library Loader to convert this file for your ECAD Tool. Learn more about ECAD Model.

XCV50-6BGG256C Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 2.5 V
Number of Equivalent Gates 57906
Number of CLBs 384
Combinatorial Delay of a CLB-Max 600 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 384 CLBS, 57906 GATES
Clock Frequency-Max 333 MHz
Supply Voltage-Max 2.625 V
Supply Voltage-Min 2.375 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 2.55 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description BGA,
Pin Count 256
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XCV50-6BGG256C Datasheet Download


XCV50-6BGG256C Overview



The XCV50-6BGG256C chip model is a powerful tool for high performance digital signal processing, embedded processing, and image processing. It is a field-programmable gate array (FPGA) that uses Hardware Description Language (HDL) to create digital logic circuits. It is designed for use in a wide range of applications, from simple logic circuits to complex systems.


The XCV50-6BGG256C chip model has several advantages over other FPGA models. It has a larger capacity of 256 CLBs, which allows for more complex logic designs. It also has a higher clock speed of up to 600MHz, allowing for faster processing. Additionally, the chip model is designed to be highly customizable, with a range of options for configuring the logic design.


The demand for the XCV50-6BGG256C chip model is expected to increase in the coming years. This is due to the increasing need for high-performance digital signal processing, embedded processing, and image processing in various industries. The chip model is also becoming more popular in the development of artificial intelligence (AI) and robotics.


The XCV50-6BGG256C chip model can be used in the development and popularization of future intelligent robots. It is capable of handling complex image processing and machine learning tasks, which are essential for the development of intelligent robots. To use the chip model effectively, technical talents with knowledge and experience in HDL language, AI, and robotics are required.


In conclusion, the XCV50-6BGG256C chip model is a powerful tool for high-performance digital signal processing, embedded processing, and image processing. It has several advantages over other FPGA models and is expected to be in high demand in the coming years. It can also be used for the development and popularization of future intelligent robots, although technical talents with knowledge and experience in HDL language, AI, and robotics are required to use it effectively.



2,275 In Stock


I want to buy

Unit Price: $106.624
The price is for reference only.
paypal mastercard unionpay dhl fedex ups

Pricing (USD)

QTY Unit Price Ext Price
1+ $99.1603 $99.1603
10+ $98.0941 $980.9408
100+ $92.7629 $9,276.2880
1000+ $87.4317 $43,715.8400
10000+ $79.9680 $79,968.0000
The price is for reference only, please refer to the actual quotation!

Quick Quote