
AMD Xilinx
XCV50-5PQG240C
XCV50-5PQG240C ECAD Model
XCV50-5PQG240C Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 2.5 V | |
Number of Equivalent Gates | 57906 | |
Number of CLBs | 384 | |
Combinatorial Delay of a CLB-Max | 700 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 384 CLBS, 57906 GATES | |
Clock Frequency-Max | 294 MHz | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
JESD-30 Code | S-PQFP-G240 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e3 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 240 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | FQFP | |
Package Shape | SQUARE | |
Package Style | FLATPACK, FINE PITCH | |
Surface Mount | YES | |
Terminal Finish | Matte Tin (Sn) | |
Terminal Form | GULL WING | |
Terminal Pitch | 500 µm | |
Terminal Position | QUAD | |
Width | 32 mm | |
Length | 32 mm | |
Seated Height-Max | 4.1 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | QFP | |
Package Description | FQFP, | |
Pin Count | 240 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
ECCN Code | EAR99 |
XCV50-5PQG240C Datasheet Download
XCV50-5PQG240C Overview
The XCV50-5PQG240C chip model is a powerful digital signal processor that has been designed to meet the ever-growing demands of high-performance embedded processing, image processing, and other digital signal processing applications. This chip model requires the use of HDL language, which is a hardware description language that allows for the design of complex digital circuits.
The future of the XCV50-5PQG240C chip model and the related industries depends on the specific technologies that are needed. With the rapid advancement of technology, the application environment may require the support of new technologies such as artificial intelligence, machine learning, and blockchain. These technologies will open up new opportunities for the XCV50-5PQG240C chip model and its related industries.
The XCV50-5PQG240C chip model can be applied to a wide range of network applications, from communication networks to storage networks. This chip model can also be used in intelligent scenarios, such as autonomous driving, smart homes, and robotics. In the future, this chip model may be used in fully intelligent systems, where it will be responsible for processing large amounts of data in real-time.
Overall, the XCV50-5PQG240C chip model is a powerful digital signal processor that is suitable for a variety of applications. It is capable of meeting the demands of high-performance embedded processing, image processing, and other digital signal processing applications. The future of the chip model and its related industries will depend on the technologies that are needed and the applications that it will be used for. The chip model can be used in networks and intelligent scenarios, and may even be used in fully intelligent systems in the future.
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