AMD Xilinx
XCV50-5CSG144C
XCV50-5CSG144C ECAD Model
XCV50-5CSG144C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 57906 | |
| Number of CLBs | 384 | |
| Combinatorial Delay of a CLB-Max | 700 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 384 CLBS, 57906 GATES | |
| Clock Frequency-Max | 294 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 800 µm | |
| Terminal Position | BOTTOM | |
| Width | 12 mm | |
| Length | 12 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | TFBGA, | |
| Pin Count | 144 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV50-5CSG144C Datasheet Download
XCV50-5CSG144C Overview
The XCV50-5CSG144C chip model is a versatile device designed for high-performance digital signal processing, embedded processing, image processing and other applications. It is a powerful integrated circuit that is suitable for a variety of applications, making it a popular choice for system designers.
The XCV50-5CSG144C chip model is based on a high-performance, low-power architecture, making it ideal for embedded applications. It is designed to be compatible with a variety of HDL languages, allowing developers to create custom applications quickly and easily. The chip model supports a wide range of features, including high-speed data transfer, multi-threading, and advanced memory management.
The XCV50-5CSG144C chip model is designed to meet the needs of today's rapidly-evolving technology landscape. It is designed to be compatible with the latest technologies, such as 5G networks and artificial intelligence, allowing developers to create powerful applications that can take advantage of these new technologies.
The XCV50-5CSG144C chip model is designed to be easy to use and integrate into existing systems. It is designed to be compatible with a variety of development tools, including software development kits, debuggers, and emulators. The chip model provides detailed documentation, including product descriptions, design requirements, and actual case studies.
When designing applications for the XCV50-5CSG144C chip model, developers must consider the specific needs of the application and the environment in which it will be used. For example, applications that require high-speed data transfer or require the use of advanced memory management techniques may require the use of additional hardware or software components. Additionally, developers must ensure that the application is compatible with the latest technologies and that the application is secure and reliable.
The XCV50-5CSG144C chip model is a powerful and versatile device that is suitable for a variety of applications. With its high-performance, low-power architecture and compatibility with a variety of HDL languages, the chip model is a popular choice for system designers. Developers must ensure that their applications are compatible with the latest technologies and that they take into account the specific needs of the application and the environment in which it will be used. With the right design and development, the XCV50-5CSG144C chip model can be a powerful tool for creating powerful and reliable applications.
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