AMD Xilinx
XCV50-5BGG256I
XCV50-5BGG256I ECAD Model
XCV50-5BGG256I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 57906 | |
| Number of CLBs | 384 | |
| Combinatorial Delay of a CLB-Max | 700 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 384 CLBS, 57906 GATES | |
| Clock Frequency-Max | 294 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.55 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 256 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV50-5BGG256I Datasheet Download
XCV50-5BGG256I Overview
The XCV50-5BGG256I chip model is a highly advanced model that is suitable for a variety of applications, such as high-performance digital signal processing, embedded processing, and image processing. It is a powerful processor that can handle complex tasks and provides excellent performance. The use of HDL language is required to program the chip model.
The XCV50-5BGG256I chip model offers a number of advantages over other chip models. It has a high clock speed, low power consumption, and a wide range of features. It is also highly reliable and can be used in a variety of applications. The chip model also provides excellent scalability, allowing it to be used in a variety of applications.
The demand for the XCV50-5BGG256I chip model is expected to increase in the future. This is due to its excellent performance and cost-effectiveness. The chip model is suitable for a variety of applications, making it an ideal choice for a variety of industries.
The product description of the XCV50-5BGG256I chip model includes details about its features, specifications, and design requirements. The design requirements include a clock speed of up to 1.2GHz, a power consumption of up to 3.2W, and a wide range of features. It also has an integrated memory controller and a wide range of peripherals.
In order to properly use the XCV50-5BGG256I chip model, it is important to understand the design requirements and the associated case studies. For example, a case study of a medical application can provide an understanding of the chip model’s capabilities and limitations. Additionally, it is important to understand the precautions that must be taken when designing with the chip model. This includes understanding the power requirements, the clock speed, and the associated peripherals.
In conclusion, the XCV50-5BGG256I chip model is a powerful and reliable processor that is suitable for a variety of applications. It has a high clock speed, low power consumption, and a wide range of features. The demand for the chip model is expected to increase in the future due to its excellent performance and cost-effectiveness. Additionally, it is important to understand the product description, design requirements, and case studies in order to properly use the chip model.
You May Also Be Interested In
5,618 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||